Products News
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How RHEED Enables Real-Time Monitoring During Molecular Beam Epitaxy
How RHEED Enables Real-Time Monitoring During Molecular Beam Epitaxy One of the most powerful advantages of Molecular Beam Epitaxy is the ability to monitor the crystal surface while the epitaxial layer is actually growing. Reflection High-Energy Electron Diffraction, better known as RHEED, is on...Read more -
Why Semi-Insulating SiC Substrates Are Sensitive to Electromagnetic Interference
Why Semi-Insulating SiC Substrates Are Sensitive to Electromagnetic Interference Semi-insulating silicon carbide (SiC) substrates are widely used in high-frequency semiconductor applications, including 5G RF power amplifiers, high-frequency devices, and base station components. With typical resis...Read more -
Milky Quartz Glass: How Microbubbles Improve Thermal Insulation and Radiation Protection
Milky quartz glass is an opaque form of quartz glass designed primarily for thermal insulation and infrared radiation management. Unlike clear quartz, which allows light and radiant energy to pass through, milky quartz uses its internal microstructure to scatter and reflect radiation. This makes ...Read more -
Black Quartz Glass: A Specialized Material for Radiation Absorption and Thermal Management
Black Quartz Glass: A Specialized Material for Radiation Absorption and Thermal Management Black quartz glass is a specialized quartz material developed for applications where optical absorption, thermal radiation management, and high-temperature stability are more important than light transmissi...Read more -
How to Design Electromagnetic Shielding for a Semi-Insulating SiC Cleanroom
How to Design Electromagnetic Shielding for a Semi-Insulating SiC Cleanroom Electromagnetic shielding is becoming an important consideration in cleanroom design for semi-insulating SiC substrate manufacturing. Because semi-insulating SiC substrates have high electrical resistivity, external elect...Read more -
Clear Quartz Glass: High-Purity Material for Optics and Semiconductor Applications
Clear Quartz Glass: High-Purity Material for Optics and Semiconductor Applications Clear quartz glass is one of the most important high-purity silica materials used in optical, semiconductor, laboratory, and high-temperature applications. With its excellent optical transmission, low impurity lev...Read more -
TGV (Through Glass Via) Process
TGV (Through Glass Via) Process TGV (Through Glass Via) is an advanced packaging technology that creates vertically through microvias in ultra-thin glass substrates and metallizes them to enable vertical interconnection between chips. Featuring low loss at high frequencies, low thermal stress, an...Read more -
Why Do Silicon Wafers Have Flats or Notch?
Silicon wafers, the foundation of integrated circuits and semiconductor devices, come with an intriguing feature – a flattened edge or a tiny notch cut into the side. This small detail actually serves an important purpose for wafer handling and device fabrication. As a leading wafer manufac...Read more -
What Is Wafer Chipping and How Can It Be Solved?
What Is Wafer Chipping and How Can It Be Solved? Wafer dicing is a critical process in semiconductor manufacturing and has a direct impact on final chip quality and performance. In actual production, wafer chipping—especially front-side chipping and back-side chipping—is a frequent and serious ...Read more -
Patterned versus Planar Sapphire Substrates: Mechanisms and Impact on Light Extraction Efficiency in GaN-Based LEDs
In GaN-based light-emitting diodes (LEDs), continuous progress in epitaxial growth techniques and device architecture has driven the internal quantum efficiency (IQE) increasingly close to its theoretical maximum. Despite these advances, the overall luminous performance of LEDs remains fundamenta...Read more -
How can we thin a wafer down to “ultra-thin”?
How can we thin a wafer down to “ultra-thin”? What exactly is an ultra-thin wafer? Typical thickness ranges (8″/12″ wafers as examples) Standard wafer: 600–775 μm Thin wafer: 150–200 μm Ultra-thin wafer: below 100 μm Extremely thin wafer: 50 μm, 30 μm, or even 10–20 μm Why a...Read more -
What Is Wafer Chipping and How Can It Be Solved?
What Is Wafer Chipping and How Can It Be Solved? Wafer dicing is a critical process in semiconductor manufacturing and has a direct impact on final chip quality and performance. In actual production, wafer chipping—especially front-side chipping and back-side chipping—is a frequent and serious de...Read more