8inch Silicon wafer P/N-type (100) 1-100Ω dummy reclaim substrate

Short Description:

Large inventory of double sided polished wafers, all wafers from 50 to 400mm in diameter If your specification is not available in our inventory, we have established long term relationships with many suppliers who are able to custom fabricate wafers to fit any unique specification. Double-sided polished wafers can be used for silicon, glass and other materials commonly used in the semiconductor industry.

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Product Detail

Product Tags

Introduce of wafer box

The 8-inch silicon wafer is a commonly used silicon substrate material and is widely used in the manufacturing process of integrated circuits. Such silicon wafers are commonly used to make various types of integrated circuits, including microprocessors, memory chips, sensors and other electronic devices. 8-inch silicon wafers are commonly used to make chips of relatively large sizes, with advantages including a larger surface area and the ability to make more chips on a single silicon wafer, leading to increased production efficiency. The 8-inch silicon wafer also has good mechanical and chemical properties, which is suitable for large-scale integrated circuit production.

Product features

8" P/N type, Polished silicon wafer (25 pcs)

Orientation: 200

Resistivity: 0.1 - 40 ohm•cm (It may vary from batch to batch)

Thickness: 725+/-20um

Prime/Monitor/Test Grade

MATERIAL PROPERTIES

Parameter	Characteristic
Type/Dopant	P, Boron N, Phosphorous N, Antimony N, Arsenic
Orientations	<100>, <111> slice off orientations per customer's specifications
Oxygen Content	10¹⁹ppmA Custom tolerances per customer's specification
Carbon Content	< 0.6 ppmA

MECHANICAL PROPERTIES

Parameter	Prime	Monitor/ Test A	Test
Diameter	200±0.2mm	200 ± 0.2mm	200 ± 0.5 mm
Thickness	725±20µm (standard)	725±25µm(standard) 450±25µm 625±25µm 1000±25µm 1300±25µm 1500±25 µm	725±50µm (standard)
TTV	< 5 µm	< 10 µm	< 15 µm
Bow	< 30 µm	< 30 µm	< 50 µm
Wrap	< 30 µm	< 30 µm	< 50 µm
Edge Rounding	SEMI-STD
Marking	Primary SEMI-Flat only, SEMI-STD Flats Jeida Flat, Notch

Parameter	Prime	Monitor/ Test A	Test
Front Side Criteria
Surface condition	Chemical Mechanical Polished	Chemical Mechanical Polished	Chemical Mechanical Polished
Surface Roughness	< 2 A°	< 2 A°	< 2 A°
Contamination Particles@ >0.3 µm	= 20	= 20	= 30
Haze,Pits Orange peel	None	None	None
Saw,Marks Striations	None	None	None
Back Side Criteria
Cracks, crowsfeet, saw marks,stains	None	None	None
Surface condition	Caustic etched