Infrared Nanosecond Laser Drilling equipment for Glass Drilling thickness≤20mm

Short Description:

Technical Summary:
The Infrared Nanosecond Laser Glass Drilling System is an industrial-grade processing solution specifically developed for precision drilling of glass materials. Utilizing a 1064nm infrared nanosecond laser source (pulse width: 10-300ns), this system achieves high-precision drilling in various glass substrates with thicknesses ≤20mm through precise energy control and beam shaping technologies.
In practical production line applications, the Infrared Nanosecond Laser Glass Drilling System demonstrates unique process advantages. Compared to conventional mechanical drilling or CO₂ laser processing, the system’s optimized thermal effect control mechanism enables precision drilling with hole diameters ranging from Φ0.1-5mm in standard soda-lime glass, while maintaining hole wall taper within ±0.5°. Particularly in smartphone camera sapphire cover lens processing, the system can consistently produce Φ0.3mm micro-hole arrays with positional accuracy of ±10μm, meeting stringent miniaturization requirements in consumer electronics. The system comes standard with automated loading/unloading interfaces for seamless integration with existing production lines.

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Product Detail

Product Tags

Main parameter

Laser type	Infrared nanosecond
Platform size	*800600(mm)**
	*20001200(mm)**
Drilling thickness	≤20(mm)
Drilling speed	0-5000(mm/s)
Drilling edge breakage	<0.5(mm)
Note: Platform size can be customized.

Laser Drilling Principle

The laser beam is focused at an optimal position relative to the workpiece thickness, then scans along predefined paths at high speed. Through interaction with the high-energy laser beam, target material is removed layer-by-layer to form cutting channels, achieving precise perforation (circular, square, or complex geometries) with controlled material separation.

Laser Drilling Advantages

· High automation integration with minimal power consumption and simplified operation；

· Non-contact processing enables unrestricted pattern geometries beyond conventional methods；

· Consumable-free operation reduces operational costs and enhances environmental sustainability；

· Superior precision with minimal edge chipping and elimination of secondary workpiece damage；

Infrared nanosecond glass laser drilling equipment 2

Sample display

Process Applications

The system is engineered for precision processing of brittle/hard materials including drilling, grooving, film removal, and surface texturing. Typical applications include:

1. Drilling and notching for shower door components

2. Precision perforation of appliance glass panels

3. Solar panel via drilling

4. Switch/socket cover plate perforation

5. Mirror coating removal with drilling

6. Custom surface texturing and grooving for specialized products

Processing Advantages

1. Large-format platform accommodates diverse product dimensions across industries

2. Complex contour drilling achieved in single-pass operation

3. Minimal edge chipping with superior surface finish (Ra <0.8μm)

4. Seamless transition between product specifications with intuitive operation

5. Cost-efficient operation featuring:

· High yield rates (>99.2%)

· Consumable-free processing

· Zero pollutant emissions

6.Non-contact processing ensures surface integrity preservation

Key Features

1. Precision Thermal Management Technology:

· Utilizes a multi-pulse progressive drilling process with adjustable single-pulse energy (0.1–50 mJ)

· Innovative lateral air curtain protection system confines the heat-affected zone to within 10% of the hole diameter

· Real-time infrared temperature monitoring module automatically compensates energy parameters (±2% stability)

2. Intelligent Processing Platform:

· Equipped with a high-precision linear motor stage (repeat positioning accuracy: ±2 μm)

· Integrated vision alignment system (5-megapixel CCD, recognition accuracy: ±5 μm)

· Preloaded process database with optimized parameters for 50+ types of glass materials

3. High-Efficiency Production Design:

· Dual-station alternating operation mode with material changeover time ≤3 seconds

· Standard processing cycle of 1 hole/0.5 sec (Φ0.5 mm through-hole)

· Modular design enables rapid interchange of focusing lens assemblies (processing range: Φ0.1–10 mm)

Brittle Hard Material Processing Applications

Material Type	Application Scenario	Processing Content
Soda-lime Glass	Shower doors	Mounting holes & drainage channels
Soda-lime Glass	Appliance control panels	Drainage hole arrays
Tempered Glass	Oven viewing windows	Ventilation hole arrays
Tempered Glass	Induction cooktops	Angled cooling channels
Borosilicate Glass	Solar panels	Mounting holes
Borosilicate Glass	Laboratory glassware	Custom drainage channels
Glass-ceramic	Cooktop surfaces	Burner positioning holes
Glass-ceramic	Induction cookers	Sensor mounting hole arrays
Sapphire	Smart device covers	Ventilation holes
Sapphire	Industrial viewports	Reinforced holes
Coated Glass	Bathroom mirrors	Mounting holes (coating removal + drilling)
Coated Glass	Curtain walls	Low-E glass concealed drainage holes
Ceramicized Glass	Switch/socket covers	Safety slots + wire holes
Ceramicized Glass	Fire barriers	Emergency pressure relief holes

XKH provides comprehensive technical support and value-added services for the infrared nanosecond laser glass drilling equipment to ensure optimal performance throughout the equipment lifecycle. We offer customized process development services where our engineering team collaborates closely with clients to establish material-specific parameter libraries, including specialized drilling programs for challenging materials like sapphire and tempered glass with thickness variations from 0.1mm to 20mm. For production optimization, we conduct on-site equipment calibration and performance validation tests, ensuring critical metrics such as hole diameter tolerance (±5μm) and edge quality (Ra<0.5μm) meet industry standards.

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