Products
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SiC ceramic plate/tray for 4inch 6inch wafer holder for ICP
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Custom-Shaped Sapphire Window High Hardness for Smartphone Screens
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12 inch SiC Substrate N Type Large Size High Performance RF Applications
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Custom N Type SiC Seed Substrate Dia153/155mm For Power Electronics
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Wafer Thinning Equipment for 4 Inch-12 Inch Sapphire/SiC/Si Wafers Processing
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12 Inch SiC substrate Diameter 300mm Thickness 750μm 4H-N Type can be customized
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Customized SiC Seed Crystal Substrates Dia 205/203/208 4H-N Type for Optical Communications
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Custom-Shaped Sapphire Optical Windows Single Crystal Al₂O₃ Wear Resistant Bespoke Dimensions Or Shape
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12inch Fully Automatic Precision Dicing Saw Equipment Wafer Dedicated Cutting System for Si/SiC & HBM (Al)
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Synthetic Colored Sapphire Rough Violet Purple High Quality Gem Crystals for Custom Jewelry
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Infrared Nanosecond Laser Drilling equipment for Glass Drilling thickness≤20mm
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Microjet laser technology equipment wafer cutting SiC material processing