Products
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Custom N Type SiC Seed Substrate Dia153/155mm For Power Electronics
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Wafer Thinning Equipment for 4 Inch-12 Inch Sapphire/SiC/Si Wafers Processing
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12 Inch SiC substrate Diameter 300mm Thickness 750μm 4H-N Type can be customized
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Customized SiC Seed Crystal Substrates Dia 205/203/208 4H-N Type for Optical Communications
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Custom-Shaped Sapphire Optical Windows Single Crystal Al₂O₃ Wear Resistant Bespoke Dimensions Or Shape
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12inch Fully Automatic Precision Dicing Saw Equipment Wafer Dedicated Cutting System for Si/SiC & HBM (Al)
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Synthetic Colored Sapphire Rough Violet Purple High Quality Gem Crystals for Custom Jewelry
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Customized Sapphire Optical Windows High Purity Transmittance ≥90%
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Fully Automatic Wafer Ring-Cutting Equipment Working Size 8inch/12inch Wafer Ring Cutting
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Mg-Doped LiNbO₃Ingots 45°Z-Cut 64°Y-Cut Orientations For 5G/6G Communication Systems
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6 Inch Conductive SiC Composite Substrate 4H Diameter 150mm Ra≤0.2nm Warp≤35μm
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Sapphire Optical Windows Single Crystal Al₂O₃ Wear-resisting Customized