Products
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LT Lithium Tantalate (LiTaO3) Crystal 2inch/3inch/4inch/6寸inch Orientaiton Y-42°/36°/108° Thickness 250-500um
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Sapphire Ingot Growth Equipment Czochralski CZ Method for Producing 2inch-12inch Sapphire Wafers
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Premium Sapphire Lift Pins Single crystal Al₂O₃ Wafer lift pin
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High Purity SiC Optical Lens Cubic 4H-semi 6SP Size Customized
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LiTaO3 Wafer 2inch-8inch 10x10x0.5 mm 1sp 2sp for 5G/6G Communications
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LiTaO3 Lithium Tantalate Ingots with Fe/Mg Doping Customized 4inch 6inch 8inch for Industrial Sensing
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Sic optical lens 6SP 10x10x10mmt 4H-SEMI HPSI Customized size
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LiNbO₃ Wafers 2inch-8inch Thickness 0.1 ~ 0.5mm TTV 3µm Custom
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SiC Ingot Growth Furnace for Large-Diameter SiC Crystal TSSG/LPE Methods
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Infrared Nanosecond Laser Drilling equipment for Glass Drilling thickness≤20mm
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Microjet laser technology equipment wafer cutting SiC material processing
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Silicon carbide diamond wire cutting machine 4/6/8/12 inch SiC ingot processing