Microjet Water-Guided Laser Cutting System for Advanced Materials

Short Description:

Overview:

As industries move toward more advanced semiconductors and multifunctional materials, precise yet gentle machining solutions become critical. This microjet water-guided laser processing system is engineered specifically for such tasks, combining solid-state Nd:YAG laser technology with a high-pressure microjet water conduit, delivering energy with extreme precision and minimal thermal stress.

Supporting both 532nm and 1064nm wavelengths with power configurations of 50W, 100W, or 200W, this system is a breakthrough solution for manufacturers working with materials like SiC, GaN, diamond, and ceramic composites. It is particularly well-suited for fabrication tasks in electronics, aerospace, optoelectronics, and clean energy sectors.

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Features

Top Advantages

1. Unparalleled Energy Focus through Water Guidance
By using a finely pressurized water jet as a laser waveguide, the system eliminates air interference and ensures full laser focus. The result is ultra-narrow cut widths—as small as 20μm—with sharp, clean edges.

2. Minimal Thermal Footprint
The system’s real-time thermal regulation ensures the heat-affected zone never exceeds 5μm, crucial for preserving material performance and avoiding microcracks.

3. Wide Material Compatibility
Dual-wavelength output (532nm/1064nm) provides enhanced absorption tuning, making the machine adaptable to a variety of substrates, from optically transparent crystals to opaque ceramics.

4. High-Speed, High-Precision Motion Control
With options for linear and direct-drive motors, the system supports high-throughput needs without compromising accuracy. Five-axis motion further enables complex pattern generation and multi-directional cuts.

5. Modular and Scalable Design
Users can tailor system configurations based on application demands—from lab-based prototyping to production-scale deployments—making it suitable across R&D and industrial domains.

Application Areas

Third-Generation Semiconductors:
Perfect for SiC and GaN wafers, the system performs dicing, trenching, and slicing with exceptional edge integrity.

Diamond and Oxide Semiconductor Machining:
Used for cutting and drilling high-hardness materials like single-crystal diamond and Ga₂O₃, with no carbonization or thermal deformation.

Advanced Aerospace Components:
Supports structural shaping of high-tensile ceramic composites and superalloys for jet engine and satellite components.

Photovoltaic and Ceramic Substrates:
Enables burr-free cutting of thin wafers and LTCC substrates, including through-holes and slot milling for interconnects.

Scintillators and Optical Components:
Maintains surface smoothness and transmission in fragile optical materials like Ce:YAG, LSO, and others.

Specification

Feature	Specification
Laser Source	DPSS Nd:YAG
Wavelength Options	532nm / 1064nm
Power Levels	50 / 100 / 200 Watts
Precision	±5μm
Cut Width	As narrow as 20μm
Heat Affected Zone	≤5μm
Motion Type	Linear / Direct Drive
Supported Materials	SiC, GaN, Diamond, Ga₂O₃, etc.

Why Choose This System?

● Eliminates typical laser machining issues like thermal cracking and edge chipping
● Improves yield and consistency for high-cost materials
● Adaptable for both pilot-scale and industrial use
● Future-proof platform for evolving materials science

Q&A

Q1: What materials can this system process?
A: The system is specially designed for hard and brittle high-value materials. It can effectively process silicon carbide (SiC), gallium nitride (GaN), diamond, gallium oxide (Ga₂O₃), LTCC substrates, aerospace composites, photovoltaic wafers, and scintillator crystals such as Ce:YAG or LSO.

Q2: How does the water-guided laser technology work?
A: It uses a high-pressure microjet of water to guide the laser beam via total internal reflection, effectively channeling laser energy with minimal scattering. This ensures ultra-fine focus, low thermal load, and precision cuts with line widths down to 20μm.

Q3: What are the available laser power configurations?
A: Customers can choose from 50W, 100W, and 200W laser power options depending on their processing speed and resolution needs. All options maintain high beam stability and repeatability.