High-Precision Wire Saw JSZ1231D 12inch sapphire Wafer Slicing

The machine adopts a compact structural design with a relatively small footprint. The machine body is made of high-strength steel, while the base uses an integrated casting structure to improve overall rigidity and long-term operational stability.

All major drive systems use direct-drive structures, helping reduce transmission errors and mechanical wear while providing lower operating noise and higher drive accuracy.

Each of the three main rollers is independently driven by a direct-drive motor. This design reduces the load caused by the wire pulling the rollers, helping reduce wire breakage as well as roller groove wear and wire consumption.

The machine features a shortened shaft spacing of approximately 270 mm, which improves wire stability during cutting and helps enhance cutting yield while reducing cutting time and wire consumption.

Dual-side wire breakage detection improves alarm sensitivity. The electrical control system also includes power-loss protection to help reduce wire breakage and workpiece scrap caused by unexpected power interruptions.

With a maximum wire speed of 2,200 m/min and precise tension control, the machine is suitable for fine-wire cutting processes while maintaining stable wire operation.

Cutting accuracy can reach ±0.01 mm, while the minimum slice thickness is less than 0.05 mm, meeting the requirements of high-precision semiconductor wafer slicing.