English

Diamond Wire Multi-Wire High-Speed High-Precision Downward Swing Cutting Machine

Diamond Wire Multi-Wire High-Speed High-Precision Downward Swing Cutting Machine Featured Image
  • Diamond Wire Multi-Wire High-Speed High-Precision Downward Swing Cutting Machine
  • Diamond Wire Multi-Wire High-Speed High-Precision Downward Swing Cutting Machine
  • Diamond Wire Multi-Wire High-Speed High-Precision Downward Swing Cutting Machine

Short Description:

The diamond wire multi-wire high-speed high-precision downward swing cutting machine is an advanced CNC equipment designed for precision processing of hard and brittle materials. It integrates multiple cutting-edge technologies, including high-speed wire running, ultra-precise motion control, multi-wire simultaneous cutting, and downward swing cutting. This machine achieves large-size workpiece processing with exceptional efficiency and surface quality.

By adopting diamond wire as the cutting medium, the machine provides superior wear resistance and cutting accuracy compared with traditional cutting methods. Its multi-wire design enables batch cutting of multiple workpieces simultaneously, greatly improving productivity while reducing manufacturing costs. The downward swing motion distributes cutting forces more evenly, minimizing surface defects and micro-cracks, resulting in smoother and cleaner cut surfaces.


Features

Detailed Diagram

pc207127262-diamond_wire_multi_wire_high_speed_high_precision_descending_oscillating_cutting_machine_副本2
pc207127263-diamond_wire_multi_wire_high_speed_high_precision_descending_oscillating_cutting_machine_副本2

Introduce

The diamond wire multi-wire high-speed high-precision downward swing cutting machine is an advanced CNC equipment designed for precision processing of hard and brittle materials. It integrates multiple cutting-edge technologies, including high-speed wire running, ultra-precise motion control, multi-wire simultaneous cutting, and downward swing cutting. This machine achieves large-size workpiece processing with exceptional efficiency and surface quality.

By adopting diamond wire as the cutting medium, the machine provides superior wear resistance and cutting accuracy compared with traditional cutting methods. Its multi-wire design enables batch cutting of multiple workpieces simultaneously, greatly improving productivity while reducing manufacturing costs. The downward swing motion distributes cutting forces more evenly, minimizing surface defects and micro-cracks, resulting in smoother and cleaner cut surfaces.

Technical Advantages

  • High-Speed Cutting: Wire running speed up to 2000 m/min, significantly reducing processing time.

  • High Precision: Cutting accuracy up to 0.01 mm, ensuring excellent thickness consistency and yield rate.

  • Multi-Wire Capability: Wire storage capacity of 20 km, supporting large-scale parallel cutting.

  • Swing Cutting: ±8° swing range at 0.83°/s evenly distributes stress, extending wire lifespan and improving surface quality.

  • Flexible Tension Control: Cutting tension adjustable from 10N to 60N (0.1N increments), adaptable to various materials.

  • Robust Structure: Machine weight of 8000 kg ensures high rigidity and stable performance during long-term operation.

  • Smart Control System: User-friendly interface with parameter setup, real-time monitoring, and fault alarm functions.

Typical Applications

  • Photovoltaic Industry

    • Cutting of monocrystalline and polycrystalline silicon ingots

    • Production of high-efficiency solar wafers

    • Enhances material utilization and reduces processing costs

  • Semiconductor Industry

    • Precision slicing of SiC, GaAs, Ge, and other semiconductor wafers

    • Large-diameter wafer cutting for chip fabrication

    • Guarantees superior surface quality for demanding semiconductor processes

  • New Material Processing

    • Sapphire substrate cutting for LED and optical components

    • Precision cutting of synthetic crystals and magnetic materials

    • Processing of quartz, glass ceramics, and other hard materials

  • Research & Laboratory Use

    • Sample preparation for new material research

    • Small-batch high-precision cutting experiments

    • Reliable process validation for R&D applications

Technical Specifications

Parameter Specification
Project Multi-line wire saw with workbench on top
Maximum workpiece size ø 204*500mm
Main roller coating diameter (Fixed at both ends) ø 240*510mm (two main rollers)
Wire running speed 2000 (MIX) m/min
Diamond wire diameter 0.1-0.5mm
Line storage capacity of supply wheel 20 (0.25 Diamond wire diameter) km
Cutting thickness range 0.1-1.0mm
Cutting accuracy 0.01mm
Vertical lifting stroke of workstation 250mm
Cutting method The material sways and descends from top to bottom, while the position of the diamond line remains unchanged
Cutting feed speed 0.01-10mm/min
Water tank 300L
Cutting fluid Anti-rust high-efficiency cutting fluid
Swing speed 0.83°/s
Air pump pressure 0.3-3MPa
Swing angle ±8°
Maximum cutting tension 10N-60N (Set minimum unit 0.1N)
Cutting depth 500mm
Workstation 1
Power supply Three-phase five-wire AC380V/50Hz
Total power of machine tool ≤92kW
Main motor (Water circulation cooling) 22*2kW
Wiring motor 1*2kW
Workbench swing motor 1.3*1kW
Tension control motor (Water circulation cooling) 5.5*2kW
Wire release and collection motor 15*2kW
External dimensions (excluding rocker arm box) 1320*2644*2840mm
External dimensions (including rocker arm box) 1780*2879*2840mm
Machine weight 8000kg

FAQ

1. Q: What is the advantage of oscillating cutting in diamond wire saws?

A: Oscillating cutting (±8°) reduces chipping to <15μm and improves surface finish (Ra<0.5μm) for brittle materials like SiC and sapphire.

 

 

2. Q: How fast can multi-wire diamond saws cut silicon wafers?

A: With 200+ wires at 1-3m/s, it cuts 300mm silicon wafers in <2 minutes, boosting productivity 5x vs single-wire saws.

 

  • Previous:
  • Next:

    • Related Products

    Write your message here and send it to us
    Hit enter to search or ESC to close