310 × 310 mm Sapphire Heat Dissipation Substrate Ai glasses
Detailed Diagram
Product Overview
The 310 × 310 mm sapphire heat dissipation substrate is a large-size thermal and insulating substrate made from high-purity single crystal sapphire. It offers excellent thermal conductivity, electrical insulation, high-temperature resistance, chemical stability, and mechanical strength.
This product is suitable for high-power electronicdevices, LED packaging, semiconductor processingcarriers, optoelectronic components, laser modules, and precision thermal management structures.
Compared with conventional glass, ceramic, or metal substrates, sapphire provides a uniquecombination of heat dissipation, electrical insulation, high hardness, and long-term stability in demanding operating environments.
Key Features
Large Size Design
With a size of 310 × 310 mm, the substrate is suitable for large-area devicepackaging, batch chip carrying, customized thermal structures, and high-power module applications.
Excellent Thermal Performance
Sapphire provides good heat transfercapability, helping devices dissipate heat efficiently, reduce operating temperature, and improve reliability and service life.
High Electrical Insulation
As an excellent insulating material, sapphire enableseffective thermal conduction while maintainingelectricalisolation, making it ideal for power electronics and high-voltage applications.
High Temperature and Corrosion Resistance
Sapphire offers outstandingresistance to high temperatures and chemical corrosion, allowing stable performance in harshprocessing and operating environments.
High Hardness and Mechanical Strength
With high hardness and excellent wear resistance, sapphire is resistant to scratches, deformation, and mechanicaldamage, making it suitable for precision and cleanroom applications.
Custom Processing Available
The substrate can be customized according to customer drawings, includingpolishing, grinding, chamfering, hole drilling, slotting, edge shaping, and special structure processing.
Typical Applications
- High-power LED heat dissipation substrates
- Semiconductor packaging carrier plates
- Laser and optoelectronic device thermal components
- Power electronics insulating heat spreaders
- Wafer processing carrier plates
- High-temperature process support plates
- Precision optical and electronic structural parts
- Customized large-size sapphire panels
Standard Specification Reference
| Item | Specification |
|---|---|
| Product Name | Sapphire Heat Dissipation Substrate |
| Material | Single Crystal Sapphire |
| Size | 310 × 310 mm |
| Thickness | Customized |
| Surface Finish | SSP / DSP / Ground surface available |
| CrystalOrientation | C-plane / A-plane / R-plane / M-plane available |
| EdgeTreatment | Chamfering, beveling, rounded corners, edge grinding |
| ProcessingOptions | Cutting, grinding, polishing, drilling, slotting, special-shaped machining |
| Main Functions | Heat dissipation, electrical insulation, carrier, packaging, structural support |
FAQ – 310 × 310 mm Sapphire Heat Dissipation Substrate
Q1: What is a 310 × 310 mm sapphire heat dissipation substrate?
A: It is a large-size substrate made from single crystal sapphire, designed for thermal management, electrical insulation, structural support, and devicepackagingapplications.
Q2: What are the main advantages of sapphire as a heat dissipation substrate?
A: Sapphire offers excellent thermal stability, high electrical insulation, high hardness, chemical resistance, and good mechanical strength. It is suitable for applications that require both heat spreading and electricalisolation.
Q3: What applications is this product suitable for?
A: It can be used in high-power LED packaging, semiconductor carrier plates, laser modules, optoelectronic devices, power electronics, high-temperature process support plates, and customized precisioncomponents.
About Us
XKH specializes in high-tech development, production, and sales of special optical glass and new crystal materials. Our products serve optical electronics, consumer electronics, and the military. We offer Sapphire optical components, mobile phone lens covers, Ceramics, LT, Silicon Carbide SIC, Quartz, and semiconductor crystal wafers. With skilled expertise and cutting-edge equipment, we excel in non-standard product processing, aiming to be a leading optoelectronic materials high-tech enterprise.
