xinkehui logo
  • Home
  • Company
    • About Xinkehui
  • Products
    • Substrate
      • Sapphire
      • SiC
      • Silicon
      • LiTaO3_LiNbO3
      • AlN
      • InP
      • GaAs
      • Other Glass
      • InSb
    • Optical Products
      • Quartz, BF33, and K9
      • Sapphire crystal
      • Sapphire tube and rod
      • Sapphire windows
    • Epitaxial Layer
      • GaN Epitaxy wafer
    • Ceramic products
    • Wafer Carrier
    • Semiconductor equipment
    • Metal single crystal material
  • News
  • Contact
English
  • Home
  • Products
  • Semiconductor equipment

Categories

  • Substrate
    • Sapphire
    • SiC
    • Silicon
    • LiTaO3_LiNbO3
    • AlN
    • GaAs
    • InP
    • InSb
    • Other Glass
  • Optical Products
    • Quartz, BF33, and K9
    • Sapphire crystal
    • Sapphire tube and rod
    • Sapphire windows
  • Epitaxial Layer
    • GaN Epitaxy wafer
  • Ceramic products
  • Wafer Carrier
  • Semiconductor equipment
  • Metal single crystal material

Featured products

  • 8Inch 200mm 4H-N SiC Wafer Conductive dummy research grade
    8Inch 200mm 4H-N SiC Wafer Condu...
  • 150mm 6 inch 0.7mm 0.5mm Sapphire Wafer Substrate Carrier C-Plane SSP/DSP
    150mm 6 inch 0.7mm 0.5mm Sapphir...
  • 4 inch Sapphire Wafer C-Plane SSP/DSP 0.43mm 0.65mm
    4 inch Sapphire Wafer C-Plane SS...
  • Sapphire window Sapphire glass lens Single crystal Al2O3material
    Sapphire window Sapphire glass l...
  • Dia50.8mm Sapphire Wafer Sapphire Window High Optical Transmittance DSP/SSP
    Dia50.8mm Sapphire Wafer Sapphir...
  • 50.8mm/100mm AlN Template on NPSS/FSS AlN template on sapphire
    50.8mm/100mm AlN Template on NPS...

Semiconductor equipment

  • 12inch Fully Automatic Precision Dicing Saw Equipment Wafer Dedicated Cutting System for Si/SiC & HBM (Al)

    12inch Fully Automatic Precision Dicing Saw Equipment Wafer Dedicated Cutting System for Si/SiC & HBM (Al)

  • Fully Automatic Wafer Ring-Cutting Equipment  Working Size 8inch/12inch Wafer Ring Cutting

    Fully Automatic Wafer Ring-Cutting Equipment Working Size 8inch/12inch Wafer Ring Cutting

  • Laser Anti-Counterfeiting Marking Equipment Sapphire Wafer Marking

    Laser Anti-Counterfeiting Marking Equipment Sapphire Wafer Marking

  • Laser Anti-Counterfeiting Marking System for Sapphire Substrates, Watch Dials, Luxury Jewelry

    Laser Anti-Counterfeiting Marking System for Sapphire Substrates, Watch Dials, Luxury Jewelry

  • SiC crystal growth furnace SiC Ingot growing 4inch 6inch 8inch PTV Lely TSSG LPE growth method

    SiC crystal growth furnace SiC Ingot growing 4inch 6inch 8inch PTV Lely TSSG LPE growth method

  • Small table laser punching machine 1000W-6000W minimum aperture 0.1MM can be used for metal glass ceramic materials

    Small table laser punching machine 1000W-6000W minimum aperture 0.1MM can be used for metal glass ceramic materials

  • High precision laser drilling machine for sapphire ceramic material gem bearing nozzle drilling

    High precision laser drilling machine for sapphire ceramic material gem bearing nozzle drilling

  • Sapphire single crystal Al2O3 growth furnace KY method Kyropoulos production of high quality sapphire crystal

    Sapphire single crystal Al2O3 growth furnace KY method Kyropoulos production of high quality sapphire crystal

  • Monocrystalline silicon growth furnace monocrystalline silicon ingot growth system equipment temperature up to 2100℃

    Monocrystalline silicon growth furnace monocrystalline silicon ingot growth system equipment temperature up to 2100℃

  • Sapphire crystal growth furnace Czochralski single crystal furnace CZ method to grow high-quality sapphire wafer

    Sapphire crystal growth furnace Czochralski single crystal furnace CZ method to grow high-quality sapphire wafer

NEWS

  • Is Lab-Grown Colored Sapphire Crystal the Future of Jewelry Materials? A Comprehensive Analysis of Its Advantages and Trends
    12/06/2025

    Is Lab-Grown Colored Sapphire Crystal the Future of Jewelry Materials? A Comprehensive Analysis o...

  • Predictions and Challenges for Fifth-Generation Semiconductor Materials
    06/06/2025

    Predictions and Challenges for Fifth-Generation Semiconductor Materials

  • Laser slicing will become the mainstream technology for cutting 8-inch silicon carbide in the future. Q&A Collection
    23/05/2025

    Laser slicing will become the mainstream technology for cutting 8-inch silicon carbide in the fut...

  • The Current Status and Trends of SiC Wafer Processing Technology
    23/05/2025

    The Current Status and Trends of SiC Wafer Processing Technology

  • Sapphire: There is more than just blue in the “top-tier” wardrobe
    12/05/2025

    Sapphire: There is more than just blue in the “top-tier” wardrobe

CONTACT

  • Rm1-1805, No.851, Dianshanhu Road; Qingpu Area; Shanghai City, China//201799
  • +86 158 0194 2596
  • +86 187 0175 6522
  • eric@xkh-semitech.com
  • doris@xkh-semitech.com

INQUIRY

For inquiries about our products or pricelist, please leave your email to us and we will be in touch within 24 hours.

  • facebook
  • twitter
  • linnk
  • youtube
Submit
© Copyright - 2010-2023 : All Rights Reserved. Sitemap - AMP Mobile
Sapphire Tube, Customized, Sic Wafer, Silicon Carbide Wafers, Sic Substrate, 6inch,
Online Inuiry
  • Send Email
  • x
    • whatsapp

      +86 15801942596 +86 18701756522

    • qq

      eric@xkh-semitech.com doris@xkh-semitech.com

    • whatsapp

      +86 15801942596 +86 18701756522

    Hit enter to search or ESC to close
    • English
    • French
    • German
    • Portuguese
    • Spanish
    • Russian
    • Japanese
    • Korean
    • Arabic
    • Irish
    • Greek
    • Turkish
    • Italian
    • Danish
    • Romanian
    • Indonesian
    • Czech
    • Afrikaans
    • Swedish
    • Polish
    • Basque
    • Catalan
    • Esperanto
    • Hindi
    • Lao
    • Albanian
    • Amharic
    • Armenian
    • Azerbaijani
    • Belarusian
    • Bengali
    • Bosnian
    • Bulgarian
    • Cebuano
    • Chichewa
    • Corsican
    • Croatian
    • Dutch
    • Estonian
    • Filipino
    • Finnish
    • Frisian
    • Galician
    • Georgian
    • Gujarati
    • Haitian
    • Hausa
    • Hawaiian
    • Hebrew
    • Hmong
    • Hungarian
    • Icelandic
    • Igbo
    • Javanese
    • Kannada
    • Kazakh
    • Khmer
    • Kurdish
    • Kyrgyz
    • Latin
    • Latvian
    • Lithuanian
    • Luxembou..
    • Macedonian
    • Malagasy
    • Malay
    • Malayalam
    • Maltese
    • Maori
    • Marathi
    • Mongolian
    • Burmese
    • Nepali
    • Norwegian
    • Pashto
    • Persian
    • Punjabi
    • Serbian
    • Sesotho
    • Sinhala
    • Slovak
    • Slovenian
    • Somali
    • Samoan
    • Scots Gaelic
    • Shona
    • Sindhi
    • Sundanese
    • Swahili
    • Tajik
    • Tamil
    • Telugu
    • Thai
    • Ukrainian
    • Urdu
    • Uzbek
    • Vietnamese
    • Welsh
    • Xhosa
    • Yiddish
    • Yoruba
    • Zulu
    • Kinyarwanda
    • Tatar
    • Oriya
    • Turkmen
    • Uyghur