Products
-
CNC Ingot Rounding Machine (for Sapphire, SiC, etc.)
-
Ultrafast Laser Rainbow Marking Machine Metal Interference Stripes
-
Glass Laser Cutting Machine for processing flat glass
-
Precision Microjet Laser System for Hard & Brittle Materials
-
High Precision Laser Drilling Machine laser drilling laser cutting
-
Glass Laser Drilling Machine
-
Ruby optics Ruby rod optical window titanium gem laser crystal
-
CVD method for producing high purity SiC raw materials in silicon carbide synthesis furnace at 1600℃
-
12 inch SiC Substrate N Type Large Size High Performance RF Applications
-
Custom N Type SiC Seed Substrate Dia153/155mm For Power Electronics
-
Wafer Thinning Equipment for 4 Inch-12 Inch Sapphire/SiC/Si Wafers Processing
-
12 Inch SiC substrate Diameter 300mm Thickness 750μm 4H-N Type can be customized