Multi-Wire Diamond Sawing Machine for SiC Sapphire Ultra-Hard Brittle Materials
Introduction to Multi-Wire Diamond Sawing Machine
The multi-wire diamond sawing machine is a state-of-the-art slicing system designed for processing extremely hard and brittle materials. By deploying numerous parallel diamond-coated wires, the machine can simultaneously cut multiple wafers in a single cycle, achieving both high throughput and precision. This technology has become an essential tool in industries such as semiconductors, solar photovoltaics, LEDs, and advanced ceramics, particularly for materials like SiC, sapphire, GaN, quartz, and alumina.
Compared with conventional single-wire cutting, the multi-wire configuration delivers dozens to hundreds of slices per batch, greatly reducing cycle time while keeping excellent flatness (Ra < 0.5 μm) and dimensional precision (±0.02 mm). Its modular design integrates automated wire tensioning, workpiece handling systems, and online monitoring, ensuring long-term, stable, and fully automated production.
Technical Parameters of Multi-Wire Diamond Sawing Machine
| Item | Specification | Item | Specification |
|---|---|---|---|
| Maximum work size (Square) | 220 × 200 × 350 mm | Drive motor | 17.8 kW × 2 |
| Maximum work size (Round) | Φ205 × 350 mm | Wire drive motor | 11.86 kW × 2 |
| Spindle spacing | Φ250 ±10 × 370 × 2 axis (mm) | Worktable lift motor | 2.42 kW × 1 |
| Principal axis | 650 mm | Swing motor | 0.8 kW × 1 |
| Wire running speed | 1500 m/min | Arrangement motor | 0.45 kW × 2 |
| Wire diameter | Φ0.12–0.25 mm | Tension motor | 4.15 kW × 2 |
| Lift speed | 225 mm/min | Slurry motor | 7.5 kW × 1 |
| Max. table rotation | ±12° | Slurry tank capacity | 300 L |
| Swing angle | ±3° | Coolant flow | 200 L/min |
| Swing frequency | ~30 times/min | Temp. accuracy | ±2 °C |
| Feed rate | 0.01–9.99 mm/min | Power supply | 335+210 (mm²) |
| Wire feed rate | 0.01–300 mm/min | Compressed air | 0.4–0.6 MPa |
| Machine size | 3550 × 2200 × 3000 mm | Weight | 13,500 kg |
Working Mechanism of Multi-Wire Diamond Sawing Machine
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Multi-Wire Cutting Motion
Multiple diamond wires move at synchronized speeds up to 1500 m/min. Precision-guided pulleys and closed-loop tension control (15–130 N) keep the wires stable, reducing the chance of deviation or breakage. -
Accurate Feeding & Positioning
Servo-driven positioning achieves ±0.005 mm accuracy. Optional laser or vision-assisted alignment enhances results for complex shapes. -
Cooling and Debris Removal
High-pressure coolant continuously removes chips and cools the work area, preventing thermal damage. Multi-stage filtration extends coolant life and reduces downtime. -
Smart Control Platform
High-response servo drivers (<1 ms) dynamically adjust feed, tension, and wire speed. Integrated recipe management and one-click parameter switching streamline mass production.
Core Benefits of Multi-Wire Diamond Sawing Machine
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High Productivity
Capable of cutting 50–200 wafers per run, with kerf loss <100 μm, improving material utilization up to 40%. Throughput is 5–10× that of traditional single-wire systems. -
Precision Control
Wire tension stability within ±0.5 N ensures consistent results on various brittle materials. Real-time monitoring on a 10" HMI interface supports recipe storage and remote operation. -
Flexible, Modular Build
Compatible with wire diameters from 0.12–0.45 mm for different cutting processes. Optional robotic handling allows fully automated production lines. -
Industrial-Grade Reliability
Heavy-duty cast/forged frames minimize deformation (<0.01 mm). Guide pulleys with ceramic or carbide coatings provide over 8000 hours of service life.
Application Fields of Multi-Wire Diamond Sawing Machine
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Semiconductors: Cutting SiC for EV power modules, GaN substrates for 5G devices.
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Photovoltaics: High-speed silicon wafer slicing with ±10 μm uniformity.
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LED & Optics: Sapphire substrates for epitaxy and precision optical elements with <20 μm edge chipping.
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Advanced Ceramics: Processing of alumina, AlN, and similar materials for aerospace and thermal management components.
FAQ – Multi-Wire Diamond Sawing Machine
Q1: What are the advantages of multi-wire sawing compared with single-wire machines?
A: Multi-wire systems can slice dozens to hundreds of wafers simultaneously, boosting efficiency by 5–10×. Material utilization is also higher with kerf loss below 100 μm, making it ideal for mass production.
Q2: What types of materials can be processed?
A: The machine is designed for hard and brittle materials, including silicon carbide (SiC), sapphire, gallium nitride (GaN), quartz, alumina (Al₂O₃), and aluminum nitride (AlN).
Q3: What is the achievable accuracy and surface quality?
A: Surface roughness can reach Ra <0.5 μm, with dimensional accuracy of ±0.02 mm. Edge chipping can be controlled to <20 μm, meeting semiconductor and optoelectronic industry standards.
Q4: Does the cutting process cause cracks or damage?
A: With high-pressure coolant and closed-loop tension control, the risk of micro-cracks and stress damage is minimized, ensuring excellent wafer integrity.
