Fully Automatic Wafer Ring-Cutting Equipment Working Size 8inch/12inch Wafer Ring Cutting

Short Description:

XKH has independently developed a fully automatic wafer edge trimming system, representing an advanced solution designed for front-end semiconductor manufacturing processes. This equipment incorporates innovative multi-axis synchronous control technology and features a high-rigidity spindle system (maximum rotation speed: 60,000 RPM), delivering precision edge trimming with cutting accuracy up to ±5μm. The system demonstrates excellent compatibility with various semiconductor substrates, including but not limited to:
1.Silicon wafers (Si): Suitable for edge processing of 8-12 inch wafers；
2.Compound semiconductors: Third-generation semiconductor materials such as GaAs and SiC；
3.Special substrates: Piezoelectric material wafers including LT/LN；

The modular design supports rapid replacement of multiple consumables including diamond blades and laser cutting heads, with compatibility exceeding industry standards. For specialized process requirements, we provide comprehensive solutions encompassing:
· Dedicated cutting consumables supply
· Custom processing services
· Process parameter optimization solutions

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Features

Technical parameters

Parameter	Unit	Specification
Maximum Workpiece Size	mm	ø12"
Spindle	Configuration	Single Spindle
	Speed	3,000–60,000 rpm
	Output Power	1.8 kW (2.4 optional) at 30,000 min⁻¹
	Max Blade Dia.	Ø58 mm
X-Axis	Cutting Range	310 mm
Y-Axis	Cutting Range	310 mm
	Step Increment	0.0001 mm
	Positioning Accuracy	≤0.003 mm/310 mm, ≤0.002 mm/5 mm (single error)
Z-Axis	Movement Resolution	0.00005 mm
Z-Axis	Repeatability	0.001 mm
θ-Axis	Max Rotation	380 deg
Spindle Type		Single spindle, equipped with rigid blade for ring cutting
Ring-Cutting Accuracy	μm	±50
Wafer Positioning Accuracy	μm	±50
Single-Wafer Efficiency	min/wafer	8
Multi-Wafer Efficiency		Up to 4 wafers processed simultaneously
Equipment Weight	kg	≈3,200
Equipment Dimensions (W×D×H)	mm	2,730 × 1,550 × 2,070

Operating Principle

The system achieves exceptional trimming performance through these core technologies:

1.Intelligent Motion Control System:
· High-precision linear motor drive (repeat positioning accuracy: ±0.5μm)
· Six-axis synchronous control supporting complex trajectory planning
· Real-time vibration suppression algorithms ensuring cutting stability

2.Advanced Detection System:
· Integrated 3D laser height sensor (accuracy: 0.1μm)
· High-resolution CCD visual positioning (5 megapixels)
· Online quality inspection module

3.Fully Automated Process:
· Automatic loading/unloading (FOUP standard interface compatible)
· Intelligent sorting system
· Closed-loop cleaning unit (cleanliness: Class 10)

Typical Applications

This equipment delivers significant value across semiconductor manufacturing applications:

Application Field	Process Materials	Technical Advantages
IC Manufacturing	8/12" Silicon Wafers	Enhances lithography alignment
Power Devices	SiC/GaN Wafers	Prevents edge defects
MEMS Sensors	SOI Wafers	Ensures device reliability
RF Devices	GaAs Wafers	Improves high-frequency performance
Advanced Packaging	Reconstituted Wafers	Increases packaging yield

Features

1.Four-station configuration for high processing efficiency；
2.Stable TAIKO ring debonding and removal；
3.High compatibility with key consumables；
4.Multi-axis synchronous trimming technology ensures precision edge cutting；
5.Fully automated process flow significantly reduces labor costs；
6.Customized worktable design enables stable processing of special structures；

Functions

1.Ring-drop detection system；
2.Automatic worktable cleaning；
3.Intelligent UV debonding system；
4.Operation log recording；
5.Factory automation module integration；

Service Commitment

XKH provides comprehensive, full lifecycle support services designed to maximize equipment performance and operational efficiency throughout your production journey.
1. Customization Services
· Tailored Equipment Configuration: Our engineering team collaborates closely with clients to optimize system parameters (cutting speed, blade selection, etc.) based on specific material properties (Si/SiC/GaAs) and process requirements.
· Process Development Support: We offer sample processing with detailed analysis reports including edge roughness measurement and defect mapping.
· Consumables Co-Development: For novel materials (e.g., Ga₂O₃), we partner with leading consumable manufacturers to develop application-specific blades/laser optics.

2. Professional Technical Support
· Dedicated On-Site Support: Assign certified engineers for critical ramp-up phases (typically 2-4 weeks), covering:
Equipment calibration & process fine-tuning
Operator competency training
ISO Class 5 cleanroom integration guidance
· Predictive Maintenance: Quarterly health checks with vibration analysis and servo motor diagnostics to prevent unplanned downtime.
· Remote Monitoring: Real-time equipment performance tracking through our IoT platform (JCFront Connect®) with automated anomaly alerts.

3. Value-added Services
· Process Knowledge Base: Access 300+ validated cutting recipes for various materials (updated quarterly).
· Technology Roadmap Alignment: Future-proof your investment with hardware/software upgrade paths (e.g., AI-based defect detection module).
· Emergency Response: Guaranteed 4-hour remote diagnosis and 48-hour on-site intervention (global coverage).

4. Service Infrastructure
· Performance Guarantee: Contractual commitment to ≥98% equipment uptime with SLA-backed response times.

Continuous Improvement

We conduct biannual customer satisfaction surveys and implement Kaizen initiatives to enhance service delivery. Our R&D team translates field insights into equipment upgrades - 30% of firmware improvements originate from client feedback.