FOSB box
Detailed Diagram
Overview of FOSB
The FOSB (Front Opening Shipping Box) is a precision-engineered, front-opening container specifically designed for the safe transport and storage of 300mm semiconductor wafers. It plays a critical role in safeguarding wafers during inter-fab transfers and long-distance shipping while ensuring that the highest levels of cleanliness and mechanical integrity are maintained.
Manufactured from ultra-clean, static-dissipative materials and engineered to SEMI standards, the FOSB offers exceptional protection against particle contamination, static discharge, and physical shock. It is widely used across global semiconductor manufacturing, logistics, and OEM/OSAT partnerships, particularly in the automated production lines of 300mm wafer fabs.
Structure & Materials of FOSB
A typical FOSB box is composed of several precision parts, all designed to work seamlessly with factory automation and ensure wafer safety:
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Main Body: Molded from high-purity engineering plastics such as PC (polycarbonate) or PEEK, providing high mechanical strength, low particle generation, and chemical resistance.
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Front Opening Door: Designed for full automation compatibility; features tight sealing gaskets that ensure minimal air exchange during transport.
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Internal Reticle/Wafer Tray: Holds up to 25 wafers securely. The tray is anti-static and cushioned to prevent wafer shifting, edge chipping, or scratching.
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Latch Mechanism: Safety locking system ensures the door remains closed during transit and handling.
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Traceability Features: Many models include embedded RFID tags, barcodes, or QR codes for full MES integration and tracking throughout the logistics chain.
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ESD Control: The materials are static-dissipative, typically with surface resistivity between 10⁶ and 10⁹ ohms, helping protect wafers from electrostatic discharge.
These components are manufactured in cleanroom environments and meet or exceed international SEMI standards such as E10, E47, E62, and E83.
Key Advantages
● High-Level Wafer Protection
FOSBs are built to safeguard wafers from physical damage and environmental contaminants:
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Fully enclosed, hermetically sealed system blocks out moisture, chemical fumes, and airborne particles.
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Anti-vibration interior reduces the risk of mechanical shocks or microcracks.
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Rigid outer shell withstands drop impacts and stacking pressure during logistics.
● Full Automation Compatibility
FOSBs are engineered for use in AMHS (Automated Material Handling Systems):
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Compatible with SEMI-compliant robotic arms, load ports, stockers, and openers.
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The front-opening mechanism aligns with standard FOUP and load port systems for seamless factory automation.
● Cleanroom-Ready Design
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Manufactured from ultra-clean, low-outgassing materials.
Easy to clean and reuse; suitable for Class 1 or higher cleanroom environments.
Free from heavy metal ions, ensuring no contamination during wafer transfer.
● Intelligent Tracking & MES Integration
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Optional RFID/NFC/barcode systems allow for complete traceability from fab to fab.
Each FOSB can be uniquely identified and tracked within the MES or WMS system.
Supports process transparency, batch identification, and inventory control.
FOSB Box – Combined Specifications Table
| Category | Item | Value |
|---|---|---|
| Materials | Wafer Contact | Polycarbonate |
| Materials | Shell, Door, Door Cushion | Polycarbonate |
| Materials | Rear Retainer | Polybutylene Terephthalate |
| Materials | Handles, Auto Flange, Info Pads | Polycarbonate |
| Materials | Gasket | Thermoplastic Elastomer |
| Materials | KC Plate | Polycarbonate |
| Specifications | Capacity | 25 wafers |
| Specifications | Depth | 332.77 mm ±0.1 mm (13.10" ±0.005") |
| Specifications | Width | 389.52 mm ±0.1 mm (15.33" ±0.005") |
| Specifications | Height | 336.93 mm ±0.1 mm (13.26" ±0.005") |
| Specifications | 2-Pack Length | 680 mm (26.77") |
| Specifications | 2-Pack Width | 415 mm (16.34") |
| Specifications | 2-Pack Height | 365 mm (14.37") |
| Specifications | Weight (Empty) | 4.6 kg (10.1 lb) |
| Specifications | Weight (Full) | 7.8 kg (17.2 lb) |
| Wafer Compatibility | Wafer Size | 300 mm |
| Wafer Compatibility | Pitch | 10.0 mm (0.39") |
| Wafer Compatibility | Planes | ±0.5 mm (0.02") from nominal |
Application Scenarios
FOSBs are essential tools in 300mm wafer logistics and storage. They are widely adopted in the following scenarios:
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Fab-to-Fab Transfers: For moving wafers between different semiconductor fabrication facilities.
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Foundry Deliveries: Transporting finished wafers from fab to customer or packaging facility.
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OEM/OSAT Logistics: In outsourced packaging and testing processes.
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Third-party Storage & Warehousing: Secure long-term or temporary storage of valuable wafers.
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Internal Wafer Transfers: In large fab campuses where remote manufacturing modules are connected via AMHS or manual transport.
In global supply chain operations, FOSBs have become the standard for high-value wafer transport, ensuring contamination-free delivery across continents.
FOSB vs. FOUP – What’s the Difference?
| Feature | FOSB (Front Opening Shipping Box) | FOUP (Front Opening Unified Pod) |
|---|---|---|
| Primary Use | Inter-fab wafer shipping and logistics | In-fab wafer transfer and automated processing |
| Structure | Rigid, sealed container with extra protection | Reusable pod optimized for internal automation |
| Airtightness | Higher sealing performance | Designed for easy access, less airtight |
| Usage Frequency | Medium (focused on safe long-distance transport) | High-frequency in automated production lines |
| Wafer Capacity | Typically 25 wafers per box | Typically 25 wafers per pod |
| Automation Support | Compatible with FOSB openers | Integrated with FOUP load ports |
| Compliance | SEMI E47, E62 | SEMI E47, E62, E84, and more |
While both serve critical roles in wafer logistics, FOSBs are purpose-built for robust shipping between fabs or to external customers, whereas FOUPs are more focused on automated production line efficiency.
Frequently Asked Questions (FAQ)
Q1: Are FOSBs reusable?
Yes. High-quality FOSBs are designed for repeated use and can withstand dozens of cleaning and handling cycles if maintained properly. Regular cleaning with certified tools is recommended.
Q2: Can FOSBs be customized for branding or tracking?
Absolutely. FOSBs can be customized with client logos, specific RFID tags, anti-moisture sealing, and even different color coding for easier logistics management.
Q3: Are FOSBs suitable for cleanroom environments?
Yes. FOSBs are manufactured from clean-grade plastics and sealed to prevent particle generation. They are suitable for Class 1 to Class 1000 cleanroom environments and critical semiconductor zones.
Q4: How are FOSBs opened during automation?
FOSBs are compatible with specialized FOSB openers that remove the front door without manual contact, maintaining the integrity of cleanroom conditions.
About Us
XKH specializes in high-tech development, production, and sales of special optical glass and new crystal materials. Our products serve optical electronics, consumer electronics, and the military. We offer Sapphire optical components, mobile phone lens covers, Ceramics, LT, Silicon Carbide SIC, Quartz, and semiconductor crystal wafers. With skilled expertise and cutting-edge equipment, we excel in non-standard product processing, aiming to be a leading optoelectronic materials high-tech enterprise.
