Diamond Wire Cutting Machine for SiC | Sapphire | Quartz | Glass
Detailed Diagram of Diamond Wire Cutting Machine
Overview of Diamond Wire Cutting Machine
The Diamond Wire Single-Line Cutting System is an advanced processing solution designed for slicing ultra-hard and brittle substrates. Using a diamond-coated wire as the cutting medium, the equipment delivers high speed, minimal damage, and cost-efficient operation. It is ideal for applications such as sapphire wafers, SiC boules, quartz plates, ceramics, optical glass, silicon rods, and gemstones.
Compared with traditional saw blades or abrasive wires, this technology provides higher dimensional accuracy, lower kerf loss, and improved surface integrity. It is widely applied across semiconductors, photovoltaics, LED devices, optics, and precision stone processing, and supports not only straight-line cutting but also special slicing of oversized or irregularly shaped materials.
Operating Principle
The machine functions by driving a diamond wire at ultra-high linear speed (up to 1500 m/min). The abrasive particles embedded in the wire remove material through micro-grinding, while auxiliary systems ensure reliability and precision:
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Precision Feeding: Servo-driven motion with linear guide rails achieves stable cutting and micron-level positioning.
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Cooling & Cleaning: Continuous water-based flushing reduces thermal influence, prevents micro-cracks, and removes debris effectively.
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Wire Tension Control: Automatic adjustment keeps constant force on the wire (±0.5 N), minimizing deviation and breakage.
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Optional Modules: Rotary stages for angled or cylindrical workpieces, high-tension systems for harder materials, and visual alignment for complex geometries.
Technical Specifications
| Item | Parameter | Item | Parameter |
|---|---|---|---|
| Max Work Size | 600×500 mm | Running Speed | 1500 m/min |
| Swing Angle | 0~±12.5° | Acceleration | 5 m/s² |
| Swing Frequency | 6~30 | Cutting Speed | <3 hrs (6-inch SiC) |
| Lift Stroke | 650 mm | Accuracy | <3 μm (6-inch SiC) |
| Sliding Stroke | ≤500 mm | Wire Diameter | φ0.12~φ0.45 mm |
| Lift Speed | 0~9.99 mm/min | Power Consumption | 44.4 kW |
| Rapid Travel Speed | 200 mm/min | Machine Size | 2680×1500×2150 mm |
| Constant Tension | 15.0N~130.0N | Weight | 3600 kg |
| Tension Accuracy | ±0.5 N | Noise | ≤75 dB(A) |
| Center Distance of Guide Wheels | 680~825 mm | Gas Supply | >0.5 MPa |
| Coolant Tank | 30 L | Power Line | 4×16+1×10 mm² |
| Mortar Motor | 0.2 kW | — | — |
Key Advantages
High Efficiency & Reduced Kerf
Wire speeds up to 1500 m/min for faster throughput.
Narrow kerf width lowers material loss by up to 30%, maximizing yield.
Flexible & User-Friendly
Touchscreen HMI with recipe storage.
Supports straight, curve, and multi-slice synchronous operations.
Expandable Functions
Rotary stage for bevel and circular cuts.
High-tension modules for stable SiC and sapphire cutting.
Optical alignment tools for non-standard parts.
Durable Mechanical Design
Heavy-duty cast frame resists vibration and ensures long-term precision.
Key wear components use ceramic or tungsten carbide coatings for >5000 hours service life.
Application Industries
Semiconductors: Efficient SiC ingot slicing with kerf loss <100 μm.
LED & Optics: High-precision sapphire wafer processing for photonics and electronics.
Solar Industry: Silicon rod cropping and wafer cutting for PV cells.
Optical & Jewelry: Fine cutting of quartz and gemstones with Ra <0.5 μm finish.
Aerospace & Ceramics: Processing AlN, zirconia, and advanced ceramics for high-temperature applications.
FAQ of Quartz Glasses
Q1: What materials can the machine cut?
A1: Optimized for SiC, sapphire, quartz, silicon, ceramics, optical glass, and gemstones.
Q2: How precise is the cutting process?
A2: For 6-inch SiC wafers, thickness accuracy can reach <3 μm, with excellent surface quality.
Q3: Why is diamond wire cutting superior to traditional methods?
A3: It offers faster speeds, reduced kerf loss, minimal thermal damage, and smoother edges compared with abrasive wires or laser cutting.
Q4: Can it process cylindrical or irregular shapes?
A4: Yes. With the optional rotary stage, it can perform circular, bevel, and angled slicing on rods or special profiles.
Q5: How is wire tension controlled?
A5: The system uses automatic closed-loop tension adjustment with ±0.5 N accuracy to prevent wire breakage and ensure stable cutting.
Q6: Which industries use this technology the most?
A6: Semiconductor manufacturing, solar energy, LED & photonics, optical component fabrication, jewelry, and aerospace ceramics.
About Us
XKH specializes in high-tech development, production, and sales of special optical glass and new crystal materials. Our products serve optical electronics, consumer electronics, and the military. We offer Sapphire optical components, mobile phone lens covers, Ceramics, LT, Silicon Carbide SIC, Quartz, and semiconductor crystal wafers. With skilled expertise and cutting-edge equipment, we excel in non-standard product processing, aiming to be a leading optoelectronic materials high-tech enterprise.
