156mm 159mm 6 inch Sapphire Wafer for carrierC-Plane DSP TTV

Short Description:

156mm/159mm diameter, 6″ Al2O3 double-sided polished (DSP) sapphire wafers with TTV less than 3 microns for carrier boards. Additional 8″ / 6″ / 5″ / 2″ / 3″ / 4″ / 5″ C-axis, A-axis, R-axis, M-axis wafers. C-plane sapphire wafers up to 6 inches (6″/6inch) in diameter, with either single-side polished (SSP) or double-side polished (DSP) surfaces, and with thicknesses of 650 microns or 1000 microns.

Send email to us

Product Detail

Product Tags

Specification

Item	6-inch C-plane(0001) Sapphire Wafers
Crystal Materials	99,999%, High Purity, Monocrystalline Al2O3
Grade	Prime, Epi-Ready
Surface Orientation	C-plane(0001)
	C-plane off-angle toward M-axis 0.2 +/- 0.1°
Diameter	100.0 mm +/- 0.1 mm
Thickness	650 μm +/- 25 μm
Primary Flat Orientation	C-plane(00-01) +/- 0.2°
Single Side Polished	Front Surface	Epi-polished, Ra < 0.2 nm (by AFM)
(SSP)	Back Surface	Fine ground, Ra = 0.8 μm to 1.2 μm
Double Side Polished	Front Surface	Epi-polished, Ra < 0.2 nm (by AFM)
(DSP)	Back Surface	Epi-polished, Ra < 0.2 nm (by AFM)
TTV	< 20 μm
BOW	< 20 μm
WARP	< 20 μm
Cleaning / Packaging	Class 100 cleanroom cleaning and vacuum packaging,
	25 pieces in one cassette packaging or single piece packaging.

The Kylopoulos method (KY method) is currently used by many companies in China to produce sapphire crystals for use in the electronics and optics industries.

In this process, high-purity aluminium oxide is melted in a crucible at temperatures above 2100 degrees Celsius. Usually the crucible is made of tungsten or molybdenum. A precisely oriented seed crystal is immersed in the molten alumina. The seed crystal is slowly pulled upwards and may be rotated simultaneously. By precisely controlling the temperature gradient, the pulling rate and the cooling rate, a large, single-crystal, nearly cylindrical ingot can be produced from the melt.

After the single crystal sapphire ingots are grown, they are drilled into cylindrical rods, which are then cut to the desired window thickness and finally polished to the desired surface finish.