12inch Fully Automatic Precision Dicing Saw Equipment Wafer Dedicated Cutting System for Si/SiC & HBM (Al)

Short Description:

The fully automatic precision dicing equipment is a high-precision cutting system specifically developed for the semiconductor and electronic components industry. It incorporates advanced motion control technology and intelligent visual positioning to achieve micron-level processing accuracy. This equipment is suitable for precision dicing of various hard and brittle materials, including:
1.Semiconductor Materials: Silicon (Si), silicon carbide (SiC), gallium arsenide (GaAs), lithium tantalate/lithium niobate (LT/LN) substrates, etc.
2.Packaging Materials: Ceramic substrates, QFN/DFN frames, BGA packaging substrates.
3.Functional Devices: Surface acoustic wave (SAW) filters, thermoelectric cooling modules, WLCSP wafers.

XKH provide material compatibility testing and process customization services to ensure the equipment perfectly matches customers’ production needs, delivering optimal solutions for both R&D samples and batch processing.

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Features

Technical parameters

Parameter	Specification
Working Size	Φ8", Φ12"
Spindle	Dual-axis 1.2/1.8/2.4/3.0, Max 60000 rpm
Blade Size	2" ~ 3"
Y1 / Y2 Axis	Single-step increment: 0.0001 mm
	Positioning accuracy: < 0.002 mm
	Cutting range: 310 mm
X Axis	Feed speed range: 0.1–600 mm/s
Z1 / Z2 Axis	Single-step increment: 0.0001 mm
Z1 / Z2 Axis	Positioning accuracy: ≤ 0.001 mm
θ Axis	Positioning accuracy: ±15"
Cleaning Station	Rotation speed: 100–3000 rpm
Cleaning Station	Cleaning method: Auto rinse & spin-dry
Operating Voltage	3-phase 380V 50Hz
Dimensions (W×D×H)	1550×1255×1880 mm
Weight	2100 kg

Working Principle

The equipment achieves high-precision cutting through the following technologies:
1.High-Rigidity Spindle System: Rotational speed up to 60,000 RPM, equipped with diamond blades or laser cutting heads to adapt to different material properties.

2.Multi-Axis Motion Control: X/Y/Z-axis positioning accuracy of ±1μm, paired with high-precision grating scales to ensure deviation-free cutting paths.

3.Intelligent Visual Alignment: High-resolution CCD (5 megapixels) automatically recognizes cutting streets and compensates for material warping or misalignment.

4.Cooling & Dust Removal: Integrated pure water cooling system and vacuum suction dust removal to minimize thermal impact and particle contamination.

Cutting Modes

1.Blade Dicing: Suitable for traditional semiconductor materials like Si and GaAs, with kerf widths of 50–100μm.

2.Stealth Laser Dicing: Used for ultra-thin wafers (<100μm) or fragile materials (e.g., LT/LN), enabling stress-free separation.

Typical Applications

Compatible Material	Application Field	Processing Requirements
Silicon (Si)	ICs, MEMS sensors	High-precision cutting, chipping <10μm
Silicon Carbide (SiC)	Power devices (MOSFET/diodes)	Low-damage cutting, thermal management optimization
Gallium Arsenide (GaAs)	RF devices, optoelectronic chips	Micro-crack prevention, cleanliness control
LT/LN Substrates	SAW filters, optical modulators	Stress-free cutting, preserving piezoelectric properties
Ceramic Substrates	Power modules, LED packaging	High-hardness material processing, edge flatness
QFN/DFN Frames	Advanced packaging	Multi-chip simultaneous cutting, efficiency optimization
WLCSP Wafers	Wafer-level packaging	Damage-free dicing of ultra-thin wafers (50μm)

Advantages

1. High-speed cassette frame scanning with collision prevention alarms, rapid transfer positioning, and strong error-correction capability.

2. Optimized dual-spindle cutting mode, improving efficiency by approximately 80% compared to single-spindle systems.

3. Precision-imported ball screws, linear guides, and Y-axis grating scale closed-loop control, ensuring long-term stability of high-precision machining.

4. Fully automated loading/unloading, transfer positioning, alignment cutting, and kerf inspection, significantly reducing operator (OP) workload.

5.Gantry-style spindle mounting structure, with a minimum dual-blade spacing of 24mm, enabling broader adaptability for dual-spindle cutting processes.

Features

1.High-precision non-contact height measurement.

2.Multi-wafer dual-blade cutting on a single tray.

3.Automatic calibration, kerf inspection, and blade breakage detection systems.

4.Supports diverse processes with selectable automatic alignment algorithms.

5.Fault self-correction functionality and real-time multi-position monitoring.

6.First-cut inspection capability post-initial dicing.

7.Customizable factory automation modules and other optional functions.

Compatible materials

Equipment Services

We provide comprehensive support from equipment selection to long-term maintenance:

(1) Customized Development
· Recommend blade/laser cutting solutions based on material properties (e.g., SiC hardness, GaAs brittleness).

· Offer free sample testing to verify cutting quality (including chipping, kerf width, surface roughness, etc.).

(2) Technical Training
· Basic Training: Equipment operation, parameter adjustment, routine maintenance.
· Advanced Courses: Process optimization for complex materials (e.g., stress-free cutting of LT substrates).

(3) After-Sales Support
· 24/7 Response: Remote diagnostics or on-site assistance.
· Spare Parts Supply: Stocked spindles, blades, and optical components for rapid replacement.
· Preventive Maintenance: Regular calibration to maintain accuracy and extend service life.

Our Advantages

✔ Industry Experience: Serving 300+ global semiconductor and electronics manufacturers.
✔ Cutting-Edge Technology: Precision linear guides and servo systems ensure industry-leading stability.
✔ Global Service Network: Coverage in Asia, Europe, and North America for localized support.
For testing or inquiries, contact us!