TGV Through Glass Via Glass BF33 Quartz JGS1 JGS2 Sapphire Material
TGV Product Introduction
Our TGV (Through Glass Via) solutions are available in a range of premium materials including BF33 borosilicate glass, fused quartz, JGS1 and JGS2 fused silica, and sapphire (single crystal Al₂O₃). These materials are selected for their excellent optical, thermal, and mechanical properties, making them ideal substrates for advanced semiconductor packaging, MEMS, optoelectronics, and microfluidic applications. We offer precision processing to meet your specific via dimensions and metallization requirements.
TGV Materials and Properties Table
| Material | Type | Typical Properties |
|---|---|---|
| BF33 | Borosilicate Glass | Low CTE, good thermal stability, easy to drill and polish |
| Quartz | Fused Silica (SiO₂) | Extremely low CTE, high transparency, excellent electrical insulation |
| JGS1 | Optical Quartz Glass | High transmission from UV to NIR, bubble-free, high purity |
| JGS2 | Optical Quartz Glass | Similar to JGS1, allows minimal bubbles |
| Sapphire | Single Crystal Al₂O₃ | High hardness, high thermal conductivity, excellent RF insulation |
TGV application
TGV Applications:
Through Glass Via (TGV) technology is widely used in advanced microelectronics and optoelectronics. Typical applications include:
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3D IC and wafer-level packaging — enabling vertical electrical interconnections through glass substrates for compact, high-density integration.
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MEMS devices — providing hermetic glass interposers with through-vias for sensors and actuators.
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RF components & antenna modules — leveraging the low dielectric loss of glass for high-frequency performance.
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Optoelectronic integration — such as micro-lens arrays and photonic circuits requiring transparent, insulating substrates.
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Microfluidic chips — incorporating precise through-holes for fluid channels and electrical access.
About XINKEHUI
Shanghai Xinkehui New Material Co., Ltd. is one of the largest optical & semiconductor suppliers in China, founded in 2002. At XKH, we have a strong R&D team composed of experienced scientists and engineers who are dedicated to the research and development of advanced electronic materials.
Our team actively focuses on innovative projects such as TGV (Through Glass Via) technology, providing tailored solutions for various semiconductor and photonic applications. Leveraging our expertise, we support academic researchers and industrial partners worldwide with high-quality wafers, substrates, and precision glass processing.
Global Partners
With our advanced semiconductor material expertise, XINKEHUI has built extensive partnerships across the globe. We proudly collaborate with world-leading companies such as Corning and Schott Glass, which allows us to continuously enhance our technical capabilities and drive innovation in areas like TGV (Through Glass Via), power electronics, and optoelectronic devices.
Through these global partnerships, we not only support cutting-edge industrial applications but also actively engage in joint development projects that push the boundaries of material technology. By working closely with these esteemed partners, XINKEHUI ensures that we remain at the forefront of the semiconductor and advanced electronics industry.
