Multi-Wire Diamond Saw TJ3000 12″ Inverted Downward Swing
Detailed Diagram
Product Positioning & Applications
The TJ3000 is a high-speed, high-precision multi-wire diamond saw developed specifically for 12-inch semiconductor wafers and sapphire substrates. It combines large-size crystal processing capability with ultra-thin slicing performance, making it suitable for both mass production and advanced R&D lines.
Typical materials:
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Silicon carbide (SiC)
Sapphire
Advanced / technical ceramics
Precious metals and hard alloys (after process evaluation)
Quartz and specialty glass
Semiconductor crystal materials
Optical glass and laminated glass
Typical applications:
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12" wafer and substrate slicing
Power device substrate manufacturing
Ceramic and glass substrate opening
Precision cutting of high-value hard-brittle components
Key Processing Capabilities
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Maximum workpiece size: Ø310 × 500 mm (supports up to 12" applications)
Diamond wire diameter range: 0.1 – 0.5 mm
Cutting thickness range: 0.1 – 20 mm
Cutting accuracy: ≈ 0.01 mm (depending on material and process conditions)
Line storage capacity of supply wheel: 20 km (based on Ø0.25 mm wire)
This capability range covers standard wafers, thin wafers, and ultra-thin substrates, while maintaining good thickness uniformity and surface quality across different product types.
Cutting Method & Motion Control
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Cutting method: inverted downward swing cutting
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The workpiece swings and feeds downward from top to bottom
The diamond wire remains stationary
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Vertical lifting stroke of worktable: 350 mm
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Swing angle: ±8°
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Swing speed: ≈ 0.83°/s
With the “workpiece swinging, wire stationary” cutting concept, the TJ3000:
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Reduces wire vibration and periodic marks
Improves cut surface roughness and thickness uniformity
Enhances flatness and parallelism for large workpieces
All axes are driven by servo motors with high-resolution feedback, ensuring excellent repeatability for feed, swing, and lifting movements.
Wire System & Productivity
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Maximum diamond wire speed: 2500 m/min
Cutting feed speed: 0.01 – 10 mm/min (continuously adjustable)
Maximum cutting tension: 0 – 80 N, with 0.1 N minimum setting unit
The combination of high wire speed, long line storage, and fine tension control provides:
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Flexible parameter optimization for different wire diameters and materials
High throughput while maintaining high yield and surface quality
Capability for 24/7 continuous mass production with fewer wire-change interruptions
The multi-wire configuration enables simultaneous slicing of multiple pieces, significantly reducing unit cutting cost.
Cooling, Filtration & Process Environment
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Water tank capacity: 300 L
Cutting fluid: high-efficiency anti-rust cutting fluid in closed circulation
System benefits:
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Stable and sufficient cooling and lubrication at the cutting zone
Effective chip removal, reducing edge chipping and micro-cracks
Extended service life of diamond wire, guide rollers, and coated rollers
Clean cutting environment, improving process stability and yield
specifications
| Technical Specifications | Details |
|---|---|
| Maximum Workpiece Size | Ø310×500mm |
| Main Roller Coating Diameter | Ø350×510mm (Two main rollers) |
| Wire Running Speed | 2500 (MAX) m/min |
| Diamond Wire Diameter | 0.1-0.5mm |
| Line Storage Capacity of Supply Wheel | 20km (0.25金刚线) |
| Cutting Thickness Range | 0.1-20mm |
| Cutting Accuracy | 0.01mm |
| Vertical Lifting Stroke of Workstation | 350mm |
| Cutting Method | Downward swing cutting (The material sways and descends from top to bottom, while the diamond wire remains stationary) |
| Cutting Feed Speed | 0.01-10m/min |
| Water Tank | 300L |
| Cutting Fluid | TJ anti-rust high-efficiency cutting fluid |
| Swing Angle | ±8° |
| Swing Speed | 0.83°/s |
| Maximum Cutting Tension | 0-80N (Set minimum unit 0.1N) |
| Number of Workbenches | 1 |
| Power Supply | Three-phase five-wire AC380V/50Hz |
| Total Power of Machine Tool | ≤113kW |
| Main Motor (Water Cooling) | 32kW×2kw |
| Wiring Motor | 1×2kW |
| Workstation Swing Motor | 1.5×1kW |
| Workstation Rising and Falling Motor | 0.4×1kW |
| Tension Control Motor (Water Cooling) | 5.5×2kW |
| Wire Release and Collection Motor | 15×2kW |
| External Dimensions (Excluding Rocker Arm Box) | 2700×1650×3050mm |
| External Dimensions (Including Rocker Arm Box) | 2950×1650×3104mm |
| Machine Weight | 8200KG |
FAQ
1. What materials can the TJ3000 cutting machine process?
The TJ3000 is designed to cut a wide range of materials, including silicon carbide (SiC), sapphire substrates, ceramics, precious metals, quartz stone, semiconductor materials, optical glass, and laminated glass.
2. What is the maximum cutting size of the TJ3000?
The maximum workpiece size the TJ3000 can handle is Ø310×500mm, allowing it to process large and ultra-thin materials efficiently.
3. What is the cutting thickness range of the machine?
The cutting thickness range is from 0.1mm to 20mm, making the machine suitable for various cutting requirements, from ultra-thin slices to thicker sections.
4. How fast can the diamond wire run on the TJ3000?
The diamond wire can run at a maximum speed of 2500 meters per minute, allowing for high-efficiency cutting and significantly improving production capacity.
About Us
XKH specializes in high-tech development, production, and sales of special optical glass and new crystal materials. Our products serve optical electronics, consumer electronics, and the military. We offer Sapphire optical components, mobile phone lens covers, Ceramics, LT, Silicon Carbide SIC, Quartz, and semiconductor crystal wafers. With skilled expertise and cutting-edge equipment, we excel in non-standard product processing, aiming to be a leading optoelectronic materials high-tech enterprise.
