Diamond Wire Three-Station Single-Wire Cutting Machine for Si Wafer/Optical Glass Material Cutting

Short Description:

The Diamond Wire Three-Station Single-Wire Cutting Machine is a precision processing device engineered for efficient squaring of brittle materials such as sapphire, jade, and ceramics. It employs a continuous diamond-coated steel wire as the cutting medium, with three independently partitioned workstations enabling synchronized cutting, wire feeding/reeling, and tension control. Servo motors drive the wire’s reciprocating motion, while a closed-loop feedback system dynamically adjusts tension (±0.5N precision), minimizing wire consumption (<0.1%) and ensuring process stability. The cutting zone is physically isolated from the operational area, featuring an open-access maintenance interface for rapid wire replacement (max length ≤150m) and component servicing (e.g., guide wheels, tension pulleys). Key specifications include a workpiece size of 600×600mm, cutting speed of 400-1200mm/h, thickness capacity of 0-800mm, and total power ≤23kW, making it ideal for high-precision slicing of semiconductor substrates, optical crystals, and new energy materials.

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Features

Product Introduction

The diamond wire three-station single-wire cutting machine is a high-precision and high-efficiency cutting equipment designed for hard and brittle materials. It utilizes diamond wire as the cutting medium and is suitable for precision processing of high-hardness materials such as silicon wafers, sapphire, silicon carbide (SiC), ceramics, and optical glass. Featuring a three-station design, this machine enables simultaneous cutting of multiple workpieces on a single device, significantly improving production efficiency and reducing manufacturing costs.

Working Principle

Diamond Wire Cutting: Uses electroplated or resin-bonded diamond wire to perform grinding-based cutting through high-speed reciprocating motion.
Three-Station Synchronous Cutting: Equipped with three independent workstations, allowing simultaneous cutting of three pieces to enhance throughput.
Tension Control: Incorporates a high-precision tension control system to maintain stable diamond wire tension during cutting, ensuring accuracy.
Cooling & Lubrication System: Employs deionized water or specialized coolant to minimize thermal damage and extend diamond wire lifespan.

Equipment Features

High-Precision Cutting: Achieves cutting accuracy of ±0.02mm, ideal for ultra-thin wafer processing (e.g., photovoltaic silicon wafers, semiconductor wafers).
High Efficiency: The three-station design increases productivity by over 200% compared to single-station machines.
Low Material Loss: Narrow kerf design (0.1–0.2mm) reduces material waste.
High Automation: Features automatic loading, alignment, cutting, and unloading systems, minimizing manual intervention.
High Adaptability: Capable of cutting various hard and brittle materials, including monocrystalline silicon, polycrystalline silicon, sapphire, SiC, and ceramics.

Technical Advantages

Advantage

Description

Multi-Station Synchronous Cutting

Three independently controlled stations enable cutting of workpieces with different thicknesses or materials, improving equipment utilization.

Intelligent Tension Control

Closed-loop control with servo motors and sensors ensures constant wire tension, preventing breakage or cutting deviations.

High-Rigidity Structure

High-precision linear guides and servo-driven systems ensure stable cutting and minimize vibration effects.

Energy Efficiency & Eco-Friendliness

Compared to traditional slurry cutting, diamond wire cutting is pollution-free, and coolant can be recycled, reducing waste treatment costs.

Intelligent Monitoring

Equipped with PLC and touch-screen control systems for real-time monitoring of cutting speed, tension, temperature, and other parameters, supporting data traceability.

Technical Specification

Model	Three station diamond single line cutting machine
Maximum workpiece size	600*600mm
Wire running speed	1000 (MIX) m/min
Diamond wire diameter	0.25-0.48mm
Line storage capacity of supply wheel	20km
Cutting thickness range	0-600mm
Cutting accuracy	0.01mm
Vertical lifting stroke of workstation	800mm
Cutting method	The material is stationary, and the diamond wire sways and descends
Cutting feed speed	0.01-10mm/min (According to the material and thickness)
Water tank	150L
Cutting fluid	Anti rust high-efficiency cutting fluid
Swing angle	±10°
Swing speed	25°/s
Maximum cutting tension	88.0N (Set minimum unit0.1n)
Cutting depth	200~600mm
Make corresponding connecting plates according to the customer's cutting range	-
Workstation	3
Power supply	Three phase five wire AC380V/50Hz
Total power of machine tool	≤32kw
Main motor	1*2kw
Wiring motor	1*2kw
Workbench swing motor	0.4*6kw
Tension control motor	4.4*2kw
Wire release and collection motor	5.5*2kw
External dimensions (excluding rocker arm box)	485921902184mm
External dimensions (including rocker arm box)	485921902184mm
Machine weight	3600ka

Application Fields

Photovoltaic Industry: Slicing of monocrystalline and polycrystalline silicon ingots to improve wafer yield.
Semiconductor Industry: Precision cutting of SiC and GaN wafers.
LED Industry: Cutting sapphire substrates for LED chip manufacturing.
Advanced Ceramics: Forming and cutting high-performance ceramics like alumina and silicon nitride.
Optical Glass: Precision processing of ultra-thin glass for camera lenses and infrared windows.