CNC Ingot Rounding Machine (for Sapphire, SiC, etc.)

Short Description:

Overview:

The CNC Ingot Rounding Machine is a high-precision, intelligent processing solution designed for reshaping hard crystal materials such as sapphire (Al₂O₃), silicon carbide (SiC), YAG, and others. This advanced equipment is engineered to convert irregular or as-grown crystal ingots into standard cylindrical shapes with precise dimensions and surface finish. Featuring a sophisticated servo-driven control system and custom grinding units, it offers full automation, including automatic centering, grinding, and dimensional correction. Ideal for upstream processing in the LED, optics, and semiconductor industries.

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Features

Key Features

Compatible with Various Crystal Materials

Capable of processing sapphire, SiC, quartz, YAG, and other ultra-hard crystal rods. Flexible design for wide material compatibility.

High-Precision CNC Control

Equipped with an advanced CNC platform that enables real-time position tracking and automatic compensation. Post-processing diameter tolerances can be maintained within ±0.02 mm.

Automated Centering and Measuring

Integrated with a CCD vision system or laser alignment module to automatically center the ingot and detect radial alignment errors. Increases first-pass yield and reduces manual intervention.

Programmable Grinding Paths

Supports multiple rounding strategies: standard cylindrical shaping, surface defect smoothing, and customized contour corrections.

Modular Mechanical Design

Built with modular components and a compact footprint. Simplified structure ensures easy maintenance, fast component replacement, and minimal downtime.

Integrated Cooling and Dust Collection

Features a powerful water-cooling system paired with a sealed negative-pressure dust extraction unit. Reduces thermal distortion and airborne particulates during grinding, ensuring safe and stable operations.

Application Areas

Sapphire Wafer Pre-processing for LEDs

Used for shaping sapphire ingots prior to slicing into wafers. Uniform rounding greatly enhances yield and reduces wafer edge damage during subsequent cutting.

SiC Rod Grinding for Semiconductor Use

Essential for preparing silicon carbide ingots in power electronics applications. Enables consistent diameter and surface quality, critical for high-yield SiC wafer production.

Optical and Laser Crystal Shaping

Precision rounding of YAG, Nd:YVO₄, and other laser materials improves optical symmetry and uniformity, ensuring consistent beam output.

Research & Experimental Material Preparation

Trusted by universities and research labs for physical shaping of novel crystals for orientation analysis and material science experiments.

Specification Of

Specification	Value
Laser Type	DPSS Nd:YAG
Wavelengths Supported	532nm / 1064nm
Power Options	50W / 100W / 200W
Positioning Accuracy	±5μm
Minimum Line Width	≤20μm
Heat-Affected Zone	≤5μm
Motion System	Linear / Direct-drive motor
Max Energy Density	Up to 10⁷ W/cm²

Conclusion

This microjet laser system redefines the limits of laser machining for hard, brittle, and thermally sensitive materials. Through its unique laser-water integration, dual-wavelength compatibility, and flexible motion system, it offers a tailored solution for researchers, manufacturers, and system integrators working with cutting-edge materials. Whether used in semiconductor fabs, aerospace labs, or solar panel production, this platform delivers reliability, repeatability, and precision that empower next-generation material processing.