News
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Glass Becomes the New Packaging Platform
Glass is rapidly becoming a platform material for terminal markets led by data centers and telecommunications. Within data centers, it underpins two key packaging carriers: chip architectures and optical input/output (I/O). Its low coefficient of thermal expansion (CTE) and deep ultraviolet (DUV...Read more -
Application Advantages and Coating Analysis of Sapphire in Rigid Endoscopes
Table of Contents 1.Exceptional Properties of Sapphire Material: The Foundation for High-Performance Rigid Endoscopes 2.Innovative Single-Side Coating Technology: Achieving the Optimum Balance between Optical Performance and Clinical Safety 3.Stringent Processing and Coating Specificati...Read more -
A Comprehensive Guide to LiDAR Window Covers
Table of Contents I. Core Functions of LiDAR Windows: Beyond Mere Protection II. Material Comparison: The Performance Balance Between Fused Silica and Sapphire III. Coating Technology: The Cornerstone Process for Enhancing Optical Performance IV. Key Performance Parameters: Quantita...Read more -
Chiplet has transformed chips
In 1965, Intel co-founder Gordon Moore articulated what became “Moore’s Law.” For over half a century it underpinned steady gains in integrated-circuit (IC) performance and declining costs—the foundation of modern digital technology. In short: the number of transistors on a chip roughly doubles e...Read more -
Metallized Optical Windows: The Unsung Enablers in Precision Optics
Metallized Optical Windows: The Unsung Enablers in Precision Optics In precision optics and optoelectronic systems, different components each play a specific role, working together to accomplish complex tasks. Because these components are manufactured in different ways, their surface treatments a...Read more -
What Are Wafer TTV, Bow, Warp, and How Are They Measured?
Directory 1. Core Concepts and Metrics 2. Measurement Techniques 3. Data Processing and Errors 4. Process Implications In semiconductor manufacturing, the thickness uniformity and surface flatness of wafers are critical factors affecting process yield. Key parameters such as Total T...Read more -
TSMC Locks in 12-Inch Silicon Carbide for New Frontier, Strategic Deployment in AI Era’s Critical Thermal Management Materials
Table of Contents 1. Technological Shift: The Rise of Silicon Carbide and Its Challenges 2. TSMC’s Strategic Shift: Exiting GaN and Betting on SiC 3. Material Competition: The Irreplaceability of SiC 4. Application Scenarios: The Thermal Management Revolution in AI Chips and Next-...Read more -
Switch Heat Dissipation Materials! Silicon Carbide Substrate Demand Set to Explode!
Table of Contents 1.Heat Dissipation Bottleneck in AI Chips and the Breakthrough of Silicon Carbide Materials 2.Characteristics and Technical Advantages of Silicon Carbide Substrates 3.Strategic Plans and Collaborative Development by NVIDIA and TSMC 4.Implementation Path and Key Technical...Read more -
Major Breakthrough in 12-Inch Silicon Carbide Wafer Laser Lift-Off Technology
Table of Contents 1.Major Breakthrough in 12-Inch Silicon Carbide Wafer Laser Lift-Off Technology 2.Multiple Significances of the Technological Breakthrough for the SiC Industry Development 3.Future Prospects: XKH’s Comprehensive Development and Industry Collaboration Recently,...Read more -
Title: What is FOUP in Chip Manufacturing?
Table of Contents 1.Overview and Core Functions of FOUP 2.Structure and Design Features of FOUP 3.Classification and Application Guidelines of FOUP 4.Operations and Importance of FOUP in Semiconductor Manufacturing 5.Technical Challenges and Future Development Trends 6.XKH’s Custo...Read more -
Wafer Cleaning Technology in Semiconductor Manufacturing
Wafer Cleaning Technology in Semiconductor Manufacturing Wafer cleaning is a critical step throughout the entire semiconductor manufacturing process and one of the key factors that directly affects device performance and production yield. During chip fabrication, even the slightest contamination ...Read more -
Wafer Cleaning Technologies and Technical Documentation
Table of Contents 1.Core Objectives and Importance of Wafer Cleaning 2.Contamination Assessment and Advanced Analytical Techniques 3.Advanced Cleaning Methods and Technical Principles 4.Technical Implementation and Process Control Essentials 5.Future Trends and Innovative Directions 6.X...Read more