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What Are Wafer TTV, Bow, Warp, and How Are They Measured?
Directory 1. Core Concepts and Metrics 2. Measurement Techniques 3. Data Processing and Errors 4. Process Implications In semiconductor manufacturing, the thickness uniformity and surface flatness of wafers are critical factors affecting process yield. Key parameters such as Total T...Read more -
TSMC Locks in 12-Inch Silicon Carbide for New Frontier, Strategic Deployment in AI Era’s Critical Thermal Management Materials
Table of Contents 1. Technological Shift: The Rise of Silicon Carbide and Its Challenges 2. TSMC’s Strategic Shift: Exiting GaN and Betting on SiC 3. Material Competition: The Irreplaceability of SiC 4. Application Scenarios: The Thermal Management Revolution in AI Chips and Next-...Read more -
Switch Heat Dissipation Materials! Silicon Carbide Substrate Demand Set to Explode!
Table of Contents 1.Heat Dissipation Bottleneck in AI Chips and the Breakthrough of Silicon Carbide Materials 2.Characteristics and Technical Advantages of Silicon Carbide Substrates 3.Strategic Plans and Collaborative Development by NVIDIA and TSMC 4.Implementation Path and Key Technical...Read more -
Major Breakthrough in 12-Inch Silicon Carbide Wafer Laser Lift-Off Technology
Table of Contents 1.Major Breakthrough in 12-Inch Silicon Carbide Wafer Laser Lift-Off Technology 2.Multiple Significances of the Technological Breakthrough for the SiC Industry Development 3.Future Prospects: XKH’s Comprehensive Development and Industry Collaboration Recently,...Read more -
Title: What is FOUP in Chip Manufacturing?
Table of Contents 1.Overview and Core Functions of FOUP 2.Structure and Design Features of FOUP 3.Classification and Application Guidelines of FOUP 4.Operations and Importance of FOUP in Semiconductor Manufacturing 5.Technical Challenges and Future Development Trends 6.XKH’s Custo...Read more -
Wafer Cleaning Technology in Semiconductor Manufacturing
Wafer Cleaning Technology in Semiconductor Manufacturing Wafer cleaning is a critical step throughout the entire semiconductor manufacturing process and one of the key factors that directly affects device performance and production yield. During chip fabrication, even the slightest contamination ...Read more -
Wafer Cleaning Technologies and Technical Documentation
Table of Contents 1.Core Objectives and Importance of Wafer Cleaning 2.Contamination Assessment and Advanced Analytical Techniques 3.Advanced Cleaning Methods and Technical Principles 4.Technical Implementation and Process Control Essentials 5.Future Trends and Innovative Directions 6.X...Read more -
Freshly Grown Single Crystals
Single crystals are rare in nature, and even when they do occur, they are usually very small—typically on the millimeter (mm) scale—and difficult to obtain. Reported diamonds, emeralds, agates, etc., generally do not enter market circulation, let alone industrial applications; most are displayed ...Read more -
The Largest Buyer of High-Purity Alumina: How Much Do You Know About Sapphire?
Sapphire crystals are grown from high-purity alumina powder with a purity of >99.995%, making them the largest demand area for high-purity alumina. They exhibit high strength, high hardness, and stable chemical properties, enabling them to operate in harsh environments such as high temperature...Read more -
What Do TTV, BOW, WARP, and TIR Mean in Wafers?
When examining semiconductor silicon wafers or substrates made of other materials, we often encounter technical indicators such as: TTV, BOW, WARP, and possibly TIR, STIR, LTV, among others. What parameters do these represent? TTV — Total Thickness Variation BOW — Bow WARP — Warp TIR — ...Read more -
Key Raw Materials for Semiconductor Production: Types of Wafer Substrates
Wafer Substrates as Key Materials in Semiconductor Devices Wafer substrates are the physical carriers of semiconductor devices, and their material properties directly determine device performance, cost, and application fields. Below are the main types of wafer substrates along with their advantag...Read more -
High-Precision Laser Slicing Equipment for 8-Inch SiC Wafers: The Core Technology for Future SiC Wafer Processing
Silicon carbide (SiC) is not only a critical technology for national defense but also a pivotal material for global automotive and energy industries. As the first critical step in SiC single-crystal processing, wafer slicing directly determines the quality of subsequent thinning and polishing. Tr...Read more