High-Precision Laser Micromachining System

Short Description:

This high-precision laser micromachining system is specially designed for microprocessing of ultra-hard and high-temperature resistant materials. It integrates a high-performance optical system and intelligent control software to deliver ultra-fine laser focusing for precision drilling, cutting, and marking. Utilizing beam expansion and focusing technology, the system achieves enhanced energy density and is paired with a high-precision XYZ motion stage for stable operation on materials like natural diamond, polycrystalline diamond (PCD), sapphire, and stainless steel.

The system includes an industrial-grade PC and custom-developed software with a user-friendly graphical interface. It supports flexible parameter settings and real-time process visualization, and is compatible with G-code and CAD file inputs, enabling streamlined programming. This equipment is widely used in the production of diamond wire drawing dies, micro-perforated silencers, and precision hardware components, empowering smart manufacturing with high efficiency, consistency, and yield.


Features

High-Precision Laser Drilling Machine Product Introduction

The high-precision laser drilling machine is a cutting-edge device that combines advanced laser technology, precision mechanical control, and intelligent operation, designed specifically for precision drilling of ultra-hard and high-temperature resistant materials. Through the precise beam expansion and focusing technology, the device achieves the smallest possible laser spot, ensuring high precision and consistency in every operation. It is widely used in diamond drawing dies, small holes in silencers, and high-precision micro-hole processing applications, particularly for ultra-hard materials like natural diamond, polycrystalline diamond, sapphire, stainless steel, and more.

 

Laser Drilling Machine Overview

The laser drilling machine adjusts the laser beam divergence angle to its optimal state, then expands and focuses the beam to achieve the smallest laser spot. Using advanced laser micro-processing technology, it performs drilling, cutting, and other operations for a variety of hard and heat-resistant materials. The machine is particularly suitable for achieving micron-level precision, high-accuracy hole positioning, and various hole shapes required in industries across the globe.

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Laser Focusing Monitoring System

The laser focusing monitoring system consists of mirrors, focusing lenses, black-and-white CCD cameras, and monitors. The system magnifies the focused beam by over 200 times, allowing for precise alignment of the workpiece to ensure the correct focal position of the laser, which guarantees processing accuracy. Below is a display showing the consistent hole dimensions achieved by the laser drilling process, with hole diameter variations controlled to within 0.001mm and a circularity of up to 98%.

  • Consistency: The image shows multiple micro-holes with a diameter variation of less than 0.001mm and a circularity of 98%, ensuring consistent precision in every drilled hole.

Computer Control System and Software

The laser focusing monitoring system consists of mirrors, focusing lenses, black-and-white CCD cameras, and monitors. The system magnifies the focused beam by over 200 times, allowing for precise alignment of the workpiece to ensure the correct focal position of the laser, which guarantees processing accuracy. Below is a display showing the consistent hole dimensions achieved by the laser drilling process, with hole diameter variations controlled to within 0.001mm and a circularity of up to 98%.

  • Consistency: The image shows multiple micro-holes with a diameter variation of less than 0.001mm and a circularity of 98%, ensuring consistent precision in every drilled hole.

Technical Specifications

Component Specification
Laser Type Green Laser
Laser Wavelength 532nm
Industrial PC IPC-510
Display Dell 21.5-inch
Maximum Power (Actual/Standard) 5W
Focusing Focal Length Japan F20
Control System Dake Laser Specialized Software
Control Workbench System Dake Laser
XY Travel 50MM
Z-Axis Travel 50MM
C-Axis Rotation High-precision Air Float Rotary Axis
Three-Jaw Chuck Taiwan Qianshida
Servo Motor Panasonic 200W
CCD Camera Industrial Digital Camera
Ball Screws, Guides Taiwan Hiwin
Control Card Dake Laser
Machine Dimensions 11008001600mm

 

Components of the Laser Drilling Machine

The machine consists of several core components that ensure efficient and stable processing performance:

  1. Laser System: Provides a stable, high-power laser beam to enable precise drilling operations.

  2. Laser Driver Power Supply: Powers the laser system to maintain consistent performance.

  3. XYZ Precision Motion Table: A three-axis motion platform for precise workpiece positioning.

  4. Precision Air Float Rotation System: Reduces friction, ensuring smooth movement of the work table.

  5. Laser Focusing Monitoring System: Continuously monitors laser focus to ensure high-precision drilling.

  6. Computer Control System: Comes with specialized software to support G-code or CAD graphic input for automatic programming.

Case Examples

  • Micro-Hole Precision and Consistency: The machine can drill micro-holes with exceptional consistency, achieving hole diameter accuracy to 0.001mm and circularity up to 98%. Below is an example showing consistent hole sizes across a series of drilled holes, demonstrating the machine's high consistency in production.

     

  • Material Versatility: The machine can handle drilling on various materials such as sapphire, diamond, metal, etc. The image below showcases how the laser drilling machine achieves consistent hole sizes across different materials, with micron-level accuracy.

     

     
  • Precision Across Multiple Hole Diameters: The machine can drill holes of various diameters with exceptional precision. The image below shows multiple holes drilled to different diameters, all with a high degree of consistency and accuracy.

     

     
  • Damage-Free Drilling: The laser drilling process ensures that there is no thermal damage or deformation on the material, keeping the surface intact and holes precise. The image demonstrates the clean, undamaged holes produced by the machine.

     

  • Precision with Nano, Pico, and Femto Laser Pulses: Depending on the type of laser pulse used (nanoseconds, picoseconds, femtoseconds), the machine delivers different precision levels. The femtosecond laser provides the highest precision, ideal for micron-level drilling.

     

  • Femtosecond Laser Processing of Square Holes: The femtosecond laser technology can also process square holes with high precision, ideal for specialized hole shapes required in certain applications.

     

  • Femtosecond Laser Through-Hole Processing: The femtosecond laser can also be used to drill through-holes, offering high precision for multi-hole materials.

 

Q&A

Q1: What materials can the system process?
A1: It supports processing of natural diamond, PCD, sapphire, stainless steel, ceramics, glass, and other ultra-hard or high-melting-point materials.

Q2: Does it support 3D surface drilling?
A2: Optional 5-axis module supports complex 3D surface machining, suitable for irregular parts like molds and turbine blades.

Q3: Can the laser source be replaced or customized?
A3: Supports replacement with different power or wavelength lasers, such as fiber lasers or femtosecond/picosecond lasers, configurable per your requirements.

Q4: How can I get technical support and after-sales service?
A4: We offer remote diagnostics, onsite maintenance, and spare parts replacement. All systems include full warranty and technical support packages.


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