Industry News
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The End of an Era? Wolfspeed Bankruptcy Reshapes the SiC Landscape
Wolfspeed Bankruptcy Signals Major Turning Point for the SiC Semiconductor Industry Wolfspeed, a long-standing leader in silicon carbide (SiC) technology, filed for bankruptcy this week, marking a significant shift in the global SiC semiconductor landscape. The company...Read more -
A Comprehensive Overview of Thin Film Deposition Techniques: MOCVD, Magnetron Sputtering, and PECVD
In semiconductor manufacturing, while photolithography and etching are the most frequently mentioned processes, epitaxial or thin film deposition techniques are equally critical. This article introduces several common thin film deposition methods used in chip fabrication, including MOCVD, magnetr...Read more -
Sapphire Thermocouple Protection Tubes: Advancing Precision Temperature Sensing in Harsh Industrial Environments
1. Temperature Measurement – The Backbone of Industrial Control With modern industries operating under increasingly complex and extreme conditions, accurate and reliable temperature monitoring has become essential. Among the various sensing technologies, thermocouples are widely adopted thanks to...Read more -
Silicon Carbide Lights Up AR Glasses, Opening Boundless New Visual Experiences
The history of human technology can often be seen as a relentless pursuit of “enhancements”—external tools that amplify natural capabilities. Fire, for example, served as an “add-on” digestive system, freeing more energy for brain development. Radio, born in the late 19th century, bec...Read more -
Laser slicing will become the mainstream technology for cutting 8-inch silicon carbide in the future. Q&A Collection
Q: What are the main technologies used in SiC wafer slicing and processing? A:Silicon carbide (SiC) has a hardness second only to diamond and is considered a highly hard and brittle material. The slicing process, which involves cutting grown crystals into thin wafers, is...Read more -
The Current Status and Trends of SiC Wafer Processing Technology
As a third-generation semiconductor substrate material, silicon carbide (SiC) single crystal has broad application prospects in the manufacturing of high-frequency and high-power electronic devices. The processing technology of SiC plays a decisive role in the production of high-quality substrate...Read more -
The rising star of the third generation semiconductor: Gallium nitride several new growth points in the future
Compared with silicon carbide devices, gallium nitride power devices will have more advantages in scenarios where efficiency, frequency, volume and other comprehensive aspects are required at the same time, such as gallium nitride based devices have been successfully app...Read more -
The development of domestic GaN industry has been accelerated
Gallium nitride (GaN) power device adoption is growing dramatically, led by Chinese consumer electronics vendors, and the market for power GaN devices is expected to reach $2 billion by 2027, up from $126 million in 2021. Currently, the consumer electronics sector is the main driver of gallium ni...Read more