Industry News
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Laser slicing will become the mainstream technology for cutting 8-inch silicon carbide in the future. Q&A Collection
Q: What are the main technologies used in SiC wafer slicing and processing? A:Silicon carbide (SiC) has a hardness second only to diamond and is considered a highly hard and brittle material. The slicing process, which involves cutting grown crystals into thin wafers, is time-consuming and prone ...Read more -
The Current Status and Trends of SiC Wafer Processing Technology
As a third-generation semiconductor substrate material, silicon carbide (SiC) single crystal has broad application prospects in the manufacturing of high-frequency and high-power electronic devices. The processing technology of SiC plays a decisive role in the production of high-quality substrate...Read more -
The rising star of the third generation semiconductor: Gallium nitride several new growth points in the future
Compared with silicon carbide devices, gallium nitride power devices will have more advantages in scenarios where efficiency, frequency, volume and other comprehensive aspects are required at the same time, such as gallium nitride based devices have been successfully app...Read more -
The development of domestic GaN industry has been accelerated
Gallium nitride (GaN) power device adoption is growing dramatically, led by Chinese consumer electronics vendors, and the market for power GaN devices is expected to reach $2 billion by 2027, up from $126 million in 2021. Currently, the consumer electronics sector is the main driver of gallium ni...Read more